June 27, 2008
YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
 YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech
Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
 Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation
Design High Flex Cables
On-Line with Web Tool
 Gore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more…
W. L. Gore & Associates
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MEMS market tops $6 billion
The worldwide microelectromechanical systems (MEMS) market topped $6 billion and is growing at a compound annual rate of 14 percent, ...
EETimes
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High-Speed Stamp Soldering
New white paper
 This paper examines stamp soldering, a solution that provides consistent amounts of molten solder onto a printed circuit board using static volumetric solder stamps during the through-hole soldering process. Click to learn more…
Juki Corporation
Worldwide Photoresist Revenue Increased 14.5% in 2007
Worldwide photoresist sales in the semiconductor industry grew for the sixth consecutive year in 2007, according to Gartner, Inc. Worldwide ...
Gartner
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The Birth of a Mobile-Handset Powerhouse
Epcos's recent acquisition of NXP Semiconductor's Radio-Frequency Microelectromechanical Systems (RF MEMS) business establishes the ...
Cellular-News
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ROHS DecaBDE exemption ending
After a challenge from Denmark and the European Parliament, the European Commission-granted EU ROHS exemption for DecaBDE will end on July 1 ...
EDN
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IBM, Zurich University put up joint nanotech lab
IBM and the ETH Zürich University will be building a joint laboratory for nanotechnology research. The research activities aim at technologies ...
EETimes India
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Orbotech acquires Photon Dynamics
Israel's Orbotech Ltd. has signed a definitive agreement to acquire U.S.-based Photon Dynamics Inc., a provider of test and repair systems for ...
EETimes
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Demand for photovoltaic cells to rise
Worldwide investments in the production of photovoltaic (PV) cells will rise dramatically over the next two years because of booming demand ...
Purchasing
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IBM Takes Gloves Off for 32 nm Low-Power Competition With TSMC
IBM engineers described the Fishkill alliance’s low-power 32 nm process technology, which includes a high-k/metal gate stack, at the 2008 ...
Semiconductor International
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The FPGA industry strives to keep on scaling
Senior technology leaders in FPGA companies occupy a unique role in the engineering community. As developers of a ubiquitous means of ...
EDN
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Vishay - Ultra-compact thick-film power resistor spans 0.01ohm to 550kohm
A new 35W thick-film POWER resistor featuring a compact, easy-to-mount TO-263 package (D2PAK) and a broad range of resistance values, has ...
Electro Pages
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Solar Plays Starting to Shine
Over the past two years, solar stocks have blossomed from idealistic but unprofitable speculative plays into revenue growth powerhouses. While ...
The Street
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Former DRAM enemies forge MRAM memory pact
Hynix Semi and Samsung are to cooperate on developing MRAM chips with the backing of the South Korean government. The two firms are deadly ...
IT Examiner
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IC Targets DDR Cache-Memory Backup
Targeting DDR cache-memory backups, Maxim Integrated Products’ DS2731 power-management IC (PMIC) integrates a single-cell Li+ charger with ...
ECNmag
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Semiconductor Packaging News
Advertising delivers!
 Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more…
Semiconductor Packaging News
'Electron Trapping' May Impact Future Microelectronics Measurements
The transistor is one of the basic building blocks of modern electronics, and the life expectancy or reliability of a transistor is often ...
PhysOrg
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Can flash replace DRAM in servers?
Spansion's move into using flash to replace DRAM in servers comes from the confluence of a number of trends: flash processes matching DRAM ...
ElectronicsWeekly
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Researchers develop new technique for fabricating nanowire circuits
Spearheaded by graduate student Mariano Zimmler and Federico Capasso, Robert L. Wallace Professor of Applied Physics and Vinton Hayes Senior ...
PhysOrg
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Over-Hyped Quality: No Less Deceptive
While delivering less quality than promotional materials would otherwise suggest is a fairly obvious sin, I'd argue that coercing consumers to ...
EDN
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Researchers tout metallization technique with magnetic materials
Researchers from the National Institute of Standards and Technology (NIST) say they have developed a process to build 3D nanoscale ...
Solid State Technology
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Danish researcher gets closer to quantum computer
Post-doc Henrik Ingerslev Jrgensen from the Nano-Science Center, located at the Niels Bohr Institute at the University of Copenhagen, claimed ...
EETimes
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Shouldering the burden to stay on track with Moore's Law
Mark R Pinto, PhD, senior vice president, chief technology officer, and general manager of energy and environmental solutions at ...
EDN
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Student develops attention-getting gallium-nitride MOSFET
A student researcher at Rensselaer Polytechnic Institute has developed a gallium-nitride MOSFET that, thanks to its ability to operate in ...
EDN
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How to select CPLDs for handheld applications
The rapid proliferation of handheld products, including mobile phones, personal media players, handheld video game players, and digital still ...
Embedded
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On the Boil: New Nano Technique Significantly Boosts Boiling Efficiency
Whoever penned the old adage “a watched pot never boils” surely never tried to heat up water in a pot lined with copper nanorods. A new ...
Rensselaer Polytechnic Institute
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Die Bonding Made Easy
Precision X-Form Needles
 The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
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Today's Sponsor
Heraeus - Celebrating 40 years
of USA Manufacturing Excellence
 Heraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. Our consolidated production area is a state-of-the-art facility with key personnel in sales, quality and research. Learn more about Heraeus materials…
Heraeus, Inc.
Red-E-Set Universal Boards Supports
ROI CALCULATOR
 Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more…
Production Solutions, Inc.
ShinEtsu Resists - Perfect for 3D packaging,
WLP, TSV and wafer bonding
 For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion.
ShinEtsu
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