We search for industry news, so you don't need to.   Thursday, Sept 11, Baltimore, MD Asymtek presents free coating and jet dispensing technology workshop including Cyber Technologies, Dow Corning, Dymax, Henkel, Lockheed Martin and HumiSeal discussing latest developments in conformal coating processes, assembly materials and jet dispensing. Reserve your seat now, breakfast & lunch included. Learn more… Asymtek Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers Hesse & Knipps PiQC Process Integrated Quality Control Hesse & Knipps NEW, patented PiQC technology targets 100% wire bonding yields, tracking data in real time so you can react quickly to production issues. Learn more… Hesse & Knipps Does your reflow offer guarantees? Ours Does • Oxygen Free Process. • Zero deg Delta T at Peak temperature. • Not to exceed Max temp for all components. • Programmable ramp rates between 1-4 deg c/sec. Click here to learn more… ATEK Systems Group   Industry and Technology News Index June 26, 2008  -  Click the title to read the full article. Korean Scientists Develop Superfast Internet Data Chip Korean scientists said they have developed a superfast chip that could lead to huge advancements in broadband Internet technology. ... Telecoms Korea We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Telecoms Korea June 26, 2008 - Technology News Korean Scientists Develop Superfast Internet Data Chip Korean scientists said they have developed a superfast chip that could lead to huge advancements in broadband Internet technology. ... Telecoms Korea To find more articles from Telecoms Korea, use the search form below. Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.