We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers June 23, 2008 YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Letters Submit Design High Flex Cables On-Line with Web Tool Gore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more… W. L. Gore & Associates Top Story   Consumer Applications Push MEMS to New Volumes MEMS will become a $7.6B business this year, as more and more developing consumer applications go into large-volume production, projects Yole ... Semiconductor International Die attach and flip chip placement The Juki CX Series The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why… Juki Corporation Industry News   Samsung mulls IC plant in Philippines South Korean chip giant Samsung Electronics Co. Ltd. is mulling over plans to invest $1 billion in a semiconductor plant in the ... EETimes As Intel Joins the Solar Sector, Is There Room for Everyone? Ignore the bashers who say solar power is hype - they, much like the Federal Reserve and our government leaders still live in the 1970s/1980s ... Seeking Alpha How Chip Toolmakers Can Survive In high tech, hostile takeovers were once considered rare. These days, it's common place. Microsoft tried to acquire Yahoo! in a melodrama ... Forbes Electromigration-Induced Failures in Plastic Encapsulated IC Packages A commercial CMOS digital potentiometer IC in an eight-pin small outline transistor package was demonstrating field failures after ~1 month of ... Semiconductor International Microsoft after Gates, Bill without Microsoft As Bill Gates prepares to walk away from Microsoft, both the man and the company he founded will face challenges getting along without each ... CNet News Sunlight + Semiconductors = Clean Water With all the concern over data centers sucking up enormous amounts of power and worries about the many gallons of water required to make ... Earth2Tech Uncertainty surrounds DRAM market, Converge reports As predicted in Converge’s May Market Insights report, the market for DDR2 memory has stabilized over the past 30 days. During this time, ... EDN Fab Repurposing Raises New Opportunities Although new 300 mm fabs dominate the headlines, 200 mm fabs continue to do much of the heavy lifting in the global semiconductor market. In ... Semiconductor International IBM, Intel take steps in solar Big business is officially going solar. This month, several of the world's biggest technology and manufacturing companies -- including ... EETimes Magma & Mentor would be sweet It is possible, as a few financial analysts have said, that Mentor's stockholders would see the Cadence offer as a good way of making a ... EETimes Ferrotec seeking solar cell inroads to break "chip rut" Chip equipment firm Ferrotec is one of many companies seeking to diversify into new growth opportunities, and its move into solar ... Solid State Technology ASMI rejects Applied's takeover bid ASM International N.V. (ASMI) has rejected an unsolicited indicative offer from Applied Materials Inc. and private-equity firm Francisco ... EETimes Applied Micro Circuits Corp. to give Freescale 'run for money' A Silicon Valley chipmaker will expand its Austin design center hoping to nick the market share of its biggest competitor -- Freescale ... Austin Business Journal N. American chip equipment orders down in May North American Manufacturers of equipment used to make semiconductors reported orders of $1.03 billion in May, down 5 percent from the ... Reuters Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Technology News   MIT Students Develop Revolutionary Solar Dish That is Hot Enough to Melt Steel The solar industry is booming. With waves of investment and grants, the solar power industry is for the first time becoming a serious business ... Daily Tech Stanford Engineers Show Nanotube Circuits Can Be Made en Masse Most innovations don’t go far unless there is a way to turn them into products that are manufacturable on a mass scale. That’s why new ... Imperial Valley News Researchers overcome mispositioned carbon nanotubes to create logic circuits at wafer-scale Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductors and related technologies, ... Nanowerk Toshiba Achieves Higher Hole Mobility for Future Generation CMOS Technology by Twisted Direct Silicon Bonding Technology Toshiba Corporation announced that, together with IBM Corporation, it has developed a higher performance CMOS FET, a high priority for advanced ... TechWhack AMD, Nvidia graphics chip designs diverge Advanced Micro Devices and Nvidia are launching graphics chips based on distinctly different design philosophies. Nvidia chips are big and ... CNet News Materials compliance solution gets eco-design capabilities Dassault Systemes, a provider of 3D and product lifecycle management (PLM) solutions, has released an update to the ENOVIA Materials ... Electronics Supply & Manufacturing CMOS Technology, Toshiba And IBM Toshiba Corporation, together with IBM Corporation, has developed a higher performance CMOS FET, a high priority for advanced system LSI ... Technology News Daily Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Corporate News Submit Optomec and Manz Automation enter into a strategic partnership agreement Optomec has entered into an exclusive OEM partnership agreement with Manz Automation AG to jointly pursue applications in the Solar market ... Optomec NVIDIA Expands Capacity w/ Verigy V93000 SoC Tester Platform Verigy announced that NVIDIA has significantly expanded its existing fleet of Verigy V93000 SoC testers. NVIDIA uses the V93000 for high ... 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Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more… ShinEtsu Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.