San Clemente, CA – YESTech, an innovative provider of yield enhancement solutions for the electronics industry, announces the introduction of the latest M1™ AOI system, developed with special design enhancements to address the unique inspection challenges presented by advanced packaging, complex wire bonding, epoxy splash and ever shrinking component sizes.

YESTech’s M1m offers advanced high-speed device inspection with exceptional defect coverage. With three megapixel resolution, telecentric optics and proprietary Fusion Lighting™ technology, the M1m inspects bond wires, die placement, SMT components and substrates, all within a footprint less than 1 sq. meter.

The M1m can be put in-line with your wire bonders or off-line to support several bonders. Options include magazine loader and unloader as well as laser and ink markers, top and bottom. Programming the M1m is fast and intuitive. With CAD data input, a complete recipe can be completed in less than 1 hour. The M1m utilizes a standard SMT package library to simplify training and insure program portability across manufacturing lines. The Offline Programming Option allows the creation of complete recipes at remote locations, without affecting production.

The M1m has a small footprint, less than 1 sq. meter, and has options for a magazine loader / unloader as well as laser or ink marking - top and bottom side. YESTech’s off-line programming software allows the engineer to program the system at any remote location while the M1m continues with production. The system also comes standard with SPC data collection capability accessible to anyone on the network.

Don Miller, YESTech President, states, "YESTech brings years of automated optical inspection experience to these demanding applications in the advanced packaging and micro-electronics markets. We believe our systems offer superior defect detection and faster throughput to further improve our customer’s yields and return on investment.”