Designed to streamline the die attach for stacked die applications, Hysol® QMI5100 and Hysol QMI5200 combine the properties and functions of die attach film and dicing tape into one product. With these dual structured materials, the film is laminated to the backside of the wafer, the wafer is diced, then picked up and moved to die placement. Using these high performance films essentially removes the need for any dispensing or curing equipment or process steps, as paste dispensing is not required and curing takes place during the standard molding process. The materials leave no burrs after dicing, enable superior bondline thickness control and eliminate the common bleed issues associated with die attach pastes. Hysol QMI5100 is a 10 micron thick material and is most commonly used on the DAX levels of the die stack. Approved for use on DA1 (the mother die) and/or DAX, Hysol QMI5200 is available in a thickness of 20 microns.

The electronics group of Henkel

Semicon West Booth # 8311, West Hall – Level 2