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June 16, 2008
Henkel Launches Die Attach Material for Smaller Die Size Wafer Backside Coating Applications
Henkel has made commercially available a new line of die attach adhesives specifically formulated to optimize wafer backside coating processes. The new Ablestik® 8000™ series materials are available in conductive and non-conductive formulations and have been engineered to address the requirements of smaller die sizes, thus enabling packages such as COLs and SOs as well as TSOPs and QFNs that generally have tight design tolerances and require controlled flow. In addition to the Ablestik 8008 electrically conductive material and the Ablestik 8008NC non-conductive formulation, Henkel also offers Ablestik 8008HT, a high thermal adhesive suitable for use in discrete and small power IC devices.
The electronics group of Henkel
Semicon West Booth # 8311, West Hall – Level 2
Contact:
Henkel
Doug Dixon
doug.dixon@us.henkel.com
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