March 2, 2010
Henkel reports better-than-expected 2009 results
Henkel anticipates the current financial year will bring a noticeable improvement to its results. While regarding the recovery of the real ...
Henkel Corporation
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December 24, 2009
Henkel Extends Representative Network in the Americas
Honoring its commitment to deliver easy access to world-class materials solutions, Henkel Corporation’s electronics group today announced an ...
Henkel
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November 23, 2009
Henkel Extends Die Attach Solder Paste Product Line
Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free ...
Henkel Corporation
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November 12, 2009
Henkel Appoints New U.S. Manufacturer’s Representatives
Henkel Corporation's electronics group has signed on two new representatives to support its sales initiatives in Northern California ...
Henkel Corporation
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September 11, 2009
Henkel’s Pioneering Ablestik® Self-Filleting® Die Attach Receives Notice that First Patent to Grant
Henkel Corporation announced that the United States Patent and Trademark Office (USPTO) has allowed a patent covering its Ablestik® Self-Filleting® ...
Henkel Corporation
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September 10, 2009
Sustainability: Henkel’s leading position confirmed
Henkel has once again been included as a leader in its sector in the Dow Jones Sustainability World Index. The Index lists corporations that ...
Henkel Corporation
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July 23, 2009
Henkel moves 20 places up the list of the world’s highest-revenue companies
Henkel has made a gain of 20 places in the annual survey of the world’s 500 highest-revenue companies published by the US business magazine ...
Henkel Corporation
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August 1, 2008
Henkel's New Wafer Backside Coating™ Portfolio Revolutionizes Die Attach Processes
With the well-respected die attach brands of Hysol® and Ablestik®, Henkel has long been recognized for consistently pushing the bar higher when ...
Henkel
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June 30, 2008
Henkel’s Dicing Die Attach Films Offer Exceptional Performance and Manufacturability
Designed to streamline the die attach for stacked die applications, Hysol® QMI5100 and Hysol QMI5200 combine the properties and functions ...
Henkel
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June 16, 2008
Henkel Launches Die Attach Material for Smaller Die Size Wafer Backside Coating Applications
Henkel has made commercially available a new line of die attach adhesives specifically formulated to optimize wafer backside coating processes ...
Henkel
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January 7, 2008
New Solder Die Attach from Henkel Offers Unique Advantages for Power Semiconductor Devices
Effective thermal control for copper leadframe power semiconductor devices is one of the most challenging issues facing package ...
Henkel Corporation
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October 25, 2007
Henkel Expands Partnership with Global Distributor Ellsworth Adhesives
Henkel Corporation announced that it has extended its relationship with leading materials distributor, Ellsworth Adhesives, and will now ...
Henkel Corporation
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October 22, 2007
Henkel Prepares for Grand Opening of Henkel Huawei Electronics
Henkel Huawei Electronics Co. Ltd. announced plans to unveil its new state-of-the-art mold compound manufacturing facility in Lianyungang ...
Henkel Corporation
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October 19, 2007
Henkel Promotes Dr. Renzhe Zhao to Technical Manager Position
Henkel Corporation today announced that Renzhe Zhao, Ph.D. will assume the role of Technical Manager of Applications Engineering in the ...
Henkel Corporation
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August 16, 2007
New Dicing Die Attach Films from Henkel Enhance Process Efficiency, Deliver Exceptional Performance
Recognizing that packaging specialists have unique manufacturing requirements, Henkel has developed a full line of die attach ...
Henkel
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August 8, 2007
Henkel Introduces Die Attach Paste for Small Die on Copper Leadframes
Adding to its portfolio of productivity enhancing die attach materials, Henkel has developed and has made commercially available Hysol® ...
Henkel
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June 20, 2007
New Die Attach Paste for Small Die on Copper Leadframes
Developed specifically for small die on copper leadframes, Hysol QMI708 die attach paste is a high performance paste for use in today’s small ...
Henkel
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May 18, 2007
Henkel's Loctite 3508 Cornerbond™ Underfill Secures Two Industry Honors
Just launched in February of this year, Henkel's new Cornerbond™ underfill system is already collecting industry accolades and ...
Henkel
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December 15, 2006
Henkel Develops New NCP Material for Flip Chip Image Sensor Applications
Extending the company’s non-conductive paste (NCP) underfill encapsulant product line to address the burgeoning image sensor market, Henkel ...
Henkel
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August 9, 2006
New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages
The next in a series of recently introduced optimized material sets, Henkel has announced a materials combination designed specifically for ...
Henkel
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August 1, 2006
Dr. Larry Crane Assumes Role as Vice President, Product Development and Engineering for the electronics group of Henkel
As the electronics group of Henkel continues its dramatic growth and next-generation materials development, it must ensure that expert ...
Henkel
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July 28, 2006
Henkel Develops Accelerated Cooling Process to Streamline Pb-Free Flip-Chip Assembly
Henkel has introduced a new process, termed Accelerated Cooling (AC), to be used in conjunction with the company's two premiere, flip-chip in package ...
Henkel Corporation
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July 25, 2006
Henkel Develops Die Attach - Mold Compound
As low-profile consumer electronics products continue to grow in popularity, compatible, reliable material set solutions for these ...
Henkel
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July 19, 2006
Pb-free Compatible Stacked Package Die Attach Adhesive Now Available from Henkel
While technical capability is certainly the top criteria in selecting advanced materials for next-generation packaging applications ...
Henkel
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June 29, 2006
Henkel to Debut Breakthrough Technologies at Semicon West
Leading packaging firms who visit the Henkel booth at Semicon West 2006 in San Francisco, California, will see several innovative materials ...
Henkel
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