DEK’s Galaxy DirEKt Ball Placement system is a unique platform that allows for solder spheres to be placed at substrate- and wafer-level, enabling placement of solder balls as small as 0.2mm in diameter at 0.3mm pitch and delivering first pass yields of over 99%.

The inherent speed advantages of high accuracy mass imaging technology have effectively enabled unlimited sphere placement volumes in a single stroke. Unlike other methods that employ serial approaches to sphere placement, the parallel processing capabilities of the Galaxy DirEKt Ball Placement system allows for amazingly repeatable accuracy and incredibly fast cycle times that are completely independent of I/O count.

In addition, for packaging specialists utilizing other processes within their facilities, the Galaxy platform is easily adaptable and can be redeployed to host countless other mass imaging applications including backside wafer coating, wafer bumping, encapsulation and underfill deposition among others.