We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers June 13, 2008 YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Letters Submit Design High Flex Cables On-Line with Web Tool Gore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more… W. L. Gore & Associates Top Story   ATE Industry Maneuvers Around ‘Perfect Storm’ of Issues at 90 nm and Below As outlined in the 2007 edition of the International Technology Roadmap for Semiconductors (ITRS), the most immediate technology challenge ... Semiconductor International Die attach and flip chip placement The Juki CX Series The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why… Juki Corporation Industry News   3G Growth Raises Qualcomm Forecast Higher-than-expected shipments of handset chips and more expensive phones led Qualcomm to raise its revenue and profit forecasts for the ... PC World University working to create nanostructures to raise thin-film solar cell efficiency Researchers at the University of California, San Diego (UCSD) are working to create thin-film "single junction" solar cells with 45% ... EDN Intersolar launches big leap to USA The market for photovoltaics devices and production equipment will explode over the years to come, said Eicke Weber, General Manager of ... EETimes Fad no more? Novellus' Chen joins GT Solar board Novellus Systems' grand poobah Rick Hill has been outspoken in his skepticism about the prospects for the solar-photovoltaic industry ... Fab Tech TI, Qualcomm to hold off Intel in booming MID market, says analyst The market for integrated circuits for inclusion in MIDs is set to grow from $29 million in 2008 to $2.6 billion in 2012, with Texas ... Electronics Supply & Manufacturing Semiconductor chemicals and materials market to grow 8.7% in 2008, says The Information Network While chip sales are expected to grow by only 6% and equipment revenues to drop 15% in 2008, sales of chemicals and materials for making the ... DigiTimes NXP Semiconductors Announces Crazy Fast Cellular Modem Did you ever think that you’d be able to download full length movies both directly and legitimately as opposed to say, watching a DVD? ... AndroidGuys Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Technology News   Multi-die packages versus multiple single die power LEDs Multi-die packages are currently the ‘flavour of the month’ amongst the high power led manufacturers. Certainly for both manufacturers and ... ElectronicsWeekly Top 50 Tech Visionaries It's easy to look at a laptop, an iPod, or a laser printer as nothing more than a tool to get work done with or to while away your free ... Exchange Morning Post Low-power environment targets chip design Further backing its support for the UPF (Unified Power Format) for ex-change of power-related design data between EDA-chip-design tools, ... EDN Achieving first-time success at 40 nm Every process generation brings new design challenges, but, for the 40-nm node, both the difficulty and the risks are exceptional. Increased ... EDN The megapixel race: a chip designer’s point of view During the operating, or integration, mode, visible photons generate electrons in the pixel cell of a CMOS image sensor. The pixel ... EDN Programmable current source requires no power supply Engineering labs are usually equipped with various power supplies, voltmeters, function generators, and oscilloscopes. One piece of ... EDN MEMS Sensor Provides 3D Orientation Info Consolidating multiple sensor functions in a single 14-pin LGA ECOPACK SMT package, STMicroelectronics’ FC30 sensor provides 3D orientation ... ECN Magazine Video: FPGA prototyping gains ground At the Design Automation Conference (DAC) in Anaheim, Calif., Mark LaPedus, semiconductor editor from EE Times, caught up with Andy ... EETimes Samsung Introduces 90-Nanometer High Performance Smart Card IC The new 90nm smart card IC (S3CC9PF) utilizes a Samsung proprietary 16-bit CalmRISC processor with 16.5KB RAM, 384KB ROM, and a large ... PhysOrg Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Corporate News Submit DirEKt Coat DEK’s DirEKt Coat™ is a unique system that uses a mass imaging platform to enable the coating of wafers with die attach materials down to 25 ... DEK MicrobondDocfish™ - Ultrafine Pitch Solder Paste, Microspheres and Tacky Fluxes for bumping applications The Umicore Business Unit “Electronic Materials” with its Product line “Microbond – EPM” introduces MicrobondDocfish, a product family of ... Umicore Highly efficient RFID Smart Label strap production FCM 20000 The Muehlbauer Technology Group is an international and independent consultant and manufacturer of innovative solutions for the Semiconductor ... Muehlbauer Technology Group Today's Sponsor Heraeus - Celebrating 40 years of USA Manufacturing Excellence Heraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. Our consolidated production area is a state-of-the-art facility with key personnel in sales, quality and research. Learn more about Heraeus materials… Heraeus, Inc. Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Run Cooler with Thermal Interface Materials from Shin Etsu Thermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more… ShinEtsu Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.