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  Lead-Free package level alloys
New White Paper
Full Wafer Die Attach White PaperNot all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications. A new breakthrough package level lead-free alloy addresses board-level alloy challenges. Click to download paper…
Henkel Corporation
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PacTech's PacLine 300
Electroless Ni Plating System
PacTech's PacLine 300Mass-production solutions for 4- to 12-inch wafers at 150 wafers/hour. Ni/Au, Ni/Pd and Ni/Pd/Au plating for Flip-Chip UBM or top metal finish for wirebond or power device clip attach. Learn more…
PacTech




Semicon West:
Infinite Possibilities
Semicon EuropaImportant decisions on the future of microelectronics will be made at SEMICON West this July. Don't watch from the sidelines—get in the action. Plan now to be at SEMICON West 2009! Learn more…
SEMI
  Corporate News Index
June 13, 2008

DirEKt Coat

DEK’s DirEKt Coat™ is a unique system that uses a mass imaging platform to enable the coating of wafers with die attach materials down to 25 microns in thickness. Enabled by a DEK-engineered ultra flat pallet, a wafer shield for active side wafer protection, a Galaxy mass imaging system and a specially designed squeegee, DirEKt Coat delivers a solution for all ultra-thin wafer-level coating processes including die attach materials, epoxy and protective backside coatings.

DEK International

Semicon Booth # 8111

Contact:
DEK

Karen Moore-Watts

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F&K Delvotec introduces
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Bonding & TestingF&K Delvotec's Desk Top Micro-Factory has been enhanced. Using a New Camera system on the Pull/Shear test head we introduce Model 5600C. A fully automatic pull & shear test machine w/ pattern recognition. You can convert to an auto wire-bonder in 3 minutes? Learn more…
F&K Delvotec




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