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  Photoresist & Post Etch
Residue Removal
Residue RemovalDynaloy's OneStep™ novel solvent technology features broad functional advantages over typical removers. OneStep™ can be applied in various advanced packaging processes and extended to BEOL applications for photoresist and post etch residue removal. Learn more…
Dynaloy LLC
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Semicon West:
Infinite Possibilities
Semicon EuropaImportant decisions on the future of microelectronics will be made at SEMICON West this July. Don't watch from the sidelines—get in the action. Plan now to be at SEMICON West 2009! Learn more…
SEMI




New Photovoltaic Coating System
Precision coating of solar wafers
Photovoltaic Coating SystemTo apply a thin, uniform layer of phosphoric acid or phosphoric oxide based dopants and other proprietary coatings for the production of solar cells, USI has Technology for every application. Learn more…
Ultrasonic Systems, Inc.
  Corporate News Index
June 13, 2008

DirEKt Coat

DEK’s DirEKt Coat™ is a unique system that uses a mass imaging platform to enable the coating of wafers with die attach materials down to 25 microns in thickness. Enabled by a DEK-engineered ultra flat pallet, a wafer shield for active side wafer protection, a Galaxy mass imaging system and a specially designed squeegee, DirEKt Coat delivers a solution for all ultra-thin wafer-level coating processes including die attach materials, epoxy and protective backside coatings.

DEK International

Semicon Booth # 8111

Contact:
DEK

Karen Moore-Watts

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Metallization Lines by ASYS
Metallization Lines4.5 GW installed with lowest breakage
rate in the industry. The ASYS portfolio for metallization lines includes loading & unloading from stack or cassettes, visual inspection stations, screen printers, post print inspection system, dryers, cooling units, laser edge isolation, buffers, cell testers and sorters. Learn more…
ASYS




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