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  Asymtek's new DispenseJet® DJ-100
combines high speed accuracy & process control
Dispensejet DJ-100 The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more…
Asymtek
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YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
M1mYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech




NEW Hesse & Knipps BONDJET BJ915L
for your leadframe applications
Bond Jet BJ920Hesse & Knipps BONDJET BJ915L heavy wire bonder gives you high speed leadframe production with dual heads, award-winning PiQC and inline shear and pull test. Learn more…
Hesse & Knipps
  Corporate News Index
June 13, 2008

DirEKt Coat

DEK’s DirEKt Coat™ is a unique system that uses a mass imaging platform to enable the coating of wafers with die attach materials down to 25 microns in thickness. Enabled by a DEK-engineered ultra flat pallet, a wafer shield for active side wafer protection, a Galaxy mass imaging system and a specially designed squeegee, DirEKt Coat delivers a solution for all ultra-thin wafer-level coating processes including die attach materials, epoxy and protective backside coatings.

DEK International

Semicon Booth # 8111

Contact:
DEK

Karen Moore-Watts

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November 10, 2008 - Corporate News
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Full Wafer Die Attach
Deposition in a Single Stroke
Full Wafer Die Attach White PaperLearn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download…
Henkel Corporation




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