The Umicore Business Unit “Electronic Materials” with its Product line “Microbond – EPM” introduces MicrobondDocfish, a product family of Wafer- and Substrate bumping materials. Main products are Ultrafine Pitch Solder Pastes, Solder Spheres and Tacky Flux.

The Ultrafine Pitch Pastes provide excellent printing behavior with tight coplanarity. Available in solvent clean (no-clean) and water soluble series, they cover a wide range of applications. All standard Pb-free alloys are available, even new developed compositions that show excellent robustness of the joint. Solder Powder with particle sizes between type 5 and 7 are standard.

Aurora™ Solder Spheres are microspheres from Duksan Hi-Metal. Standard diameter for bumping applications is 300 to 70 ìm and below. A wide range of lead free alloys is available, even very sophisticated, recently developed compositions, with superior drop test and thermal cycling results.

Tacky Fluxes, with customized features as different viscosity and activation grades are available in solvent clean (no-clean) and water soluble series. Designed to be used in all state of the art reflow soldering systems. All of them are perfectly suited for printing processes as well as for dipping, spraying and jetting applications.

As a material supplier Microbond - EPM develops, manufactures and commercializes customized material solutions. These products offer Umicore customers high process yields and robust products.

The MicrobondDocfish Series will be presented during Semicon West 2008, booth no.8421