June 9, 2008
YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
 YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech
Full Wafer Die Attach
Deposition in a Single Stroke
 Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download…
Henkel Corporation
Design High Flex Cables
On-Line with Web Tool
 Gore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more…
W. L. Gore & Associates
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AMD misses the emerging subpar market
There is a new trend in computing, and Advanced Micro Devices Inc. is not on its bandwagon. I call the trend subpar computing. The AMD-Intel ...
Market Watch
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Die attach and flip chip placement
 The Juki CX Series
The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why…
Juki Corporation
Exclusive
JUKI Reaches Three Milestones
 A very interesting set of milestones are being celebrated at JUKI Automation headquarters in Tokyo Japan this week. It is JUKI's 70th anniversary, their 21st year in placement and they have just sold their 20,000th machine. This morning Kaz Nomoto, General Manager for the JUKI Corporation Electronic Assembly ...
Steve DeCollibus, Managing Editor
Semiconductor Packaging News
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How to Prevent Further NAND Commoditization
The global economic downturn isn’t helping the NAND flash market, with the per-megabyte price for the memory plummeting by 36% in the first ...
iSuppli Corporation
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ARM takes on Intel for the ultra-mobile PC
ARM is going head-to-head with Intel in the ultra-mobile PC space, dubbed MIDS or mobile Internet devices. Qualcomm, Texas Instruments ...
Electronics Weekly
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Get Connected With SEMICONNECT
Find the exhibitors, products, people and events at SEMICON West 2008 that match your interests. Free to all registered visitors, ...
Semiconductor International
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The flop of the Flip: A cautionary tale
Manufacturers and retailers allow consumers to return a brand new consumer product for free, even if it's out of the box and the box is ...
EETimes
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Applied Materials Wants The Cream
Applied Materials is hoping that Dutch semiconductor equipment maker ASM International may be so down on its luck that it is willing to sell of ...
Forbes
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Supercomputer sets record
An American military supercomputer, assembled from components originally designed for video game machines, has reached a long-sought-after ...
International Herald Tribune
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Tech's future is clean
It was Shakespeare's Mark Antony who said: "I come to bury Caesar, not to praise him." I'd like to modify that in 2008 and offer: "I come to ...
National Post
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Exports down by 3.4% - fuel bill almost doubles
However, during the same period, imports rose by 8.1 per cent as a result of which the visible trade gap widened by €62.3 million in April 2008 ...
di-ve
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Realtek Announces Collaboration With ASUS on Industry-First Wireless Monitors Based on Wireless USB Technology
Realtek Semiconductor Corp. announced it is collaborating with ASUSTeK Computer Inc. on wireless monitors; a new product series designed to ...
FOX Business
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Hi-tech auto gadgets from KPIT by year-end
Imagine an alarm going off in your car when you fall asleep while driving or your vehicle skidding on a rain-soaked road. Or, for that matter, ...
Financial Express
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Semiconductor Packaging News
Advertising delivers!
 Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more…
Semiconductor Packaging News
Improve Your Uptime
High Precision Dispense Tips
 The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology
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Today's Sponsor
Heraeus - Celebrating 40 years
of USA Manufacturing Excellence
 Heraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. While competitors are mainly focusing off shore, Heraeus is committed to serving all markets. Learn more about Heraeus materials…
Heraeus, Inc.
Red-E-Set Universal Boards Supports
ROI CALCULATOR
 Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more…
Production Solutions, Inc.
ShinEtsu Resists - Perfect for 3D packaging,
WLP, TSV and wafer bonding
 For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion.
ShinEtsu
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