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Thursday, Sept 11, Baltimore, MD Asymtek presents free
coating and jet dispensing technology workshop including Cyber Technologies, Dow Corning, Dymax, Henkel, Lockheed Martin and HumiSeal discussing latest developments in conformal coating processes, assembly materials and jet dispensing. Reserve your seat now, breakfast & lunch included. Learn more
Asymtek
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White Paper Download |
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BGA/CSP Re-balling
The trend in the electronics interconnect industry towards "Area Array Packages" type packages and away from high pin count leaded packages has increased dramatically over the last several years. The primary reasons are included in this white paper.
Circuit Technology Inc.
Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load.
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