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May 30, 2008
YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
 YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech
Full Wafer Die Attach
Deposition in a Single Stroke
 Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download…
Henkel Corporation
Design High Flex Cables
On-Line with Web Tool
 Gore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more…
W. L. Gore & Associates
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High-Speed Stamp Soldering
New white paper
 This paper examines stamp soldering, a solution that provides consistent amounts of molten solder onto a printed circuit board using static volumetric solder stamps during the through-hole soldering process. Click to learn more…
Juki Corporation
REACH and the electronics supply chain: Are you ready?
Wait and see is not an option for any business selling products in the EU. There are many reasons why the electronics industry should be ...
Electronics Supply & Manufacturing
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TSIA: Taiwan semiconductor sales down with seasonal slowdown in 1Q08
The Taiwan Semiconductor Industry Association (TSIA) reported that Taiwan's semiconductor production value went up 0.4% on year and ...
DigiTimes
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Semicon West features 450-mm debate, solar show
The sparks are expected to fly at the upcoming Semicon West trade show in San Francisco, as the industry is expected to debate 450-mm fabs, ...
EETimes
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ADAG hires former AMD head for semiconductor business
The Reliance Mukesh Ambani group has hired the former head of chipmaker AMD’s business in India, Ajay Marathe, for its semiconductor foray. ...
The Economic Times
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Can ST Become Fabless?
On Tuesday, Vijay Nagarajan completed his in-depth of analysis of STMicroelectronics (STM). I will review his analysis as well as ...
Seeking Alpha
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Japan microchip gear orders down 48.8 pct in April
Orders for Japanese semiconductor-making equipment fell by almost half in April as memory chip makers remained cautious on capital spending ...
Reuters
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M&A activities in the 2008 electronics industry
According to a recent study by the Electronics and Semiconductor Group (ESG) at Core Capital Group, consolidation is driven by 17% of the ...
Electronics Supply & Manufacturing
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Intel, Micron roll 34-nm NAND device
Intel Corp. and Micron Technology Inc. have leapfrogged the competition and claimed the technical lead in the NAND flash memory market. ...
EETimes
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World Renowned MEMS, Nano and Semiconductor Technology Leaders Join WiSpry's Technical Advisory Board
WiSpry, Inc., the leader in programmable radio frequency (RF) semiconductor products for the wireless industry, today announced the ...
Earthtimes
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ST offers Chinese universities access to CMOS processes
To strengthen links with Chinese education and research communities, semiconductor manufacturer STMicroelectronics and IC broker Circuits ...
EDN
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Semiconductor Packaging News
Advertising delivers!
 Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more…
Semiconductor Packaging News
IMEC, Renesas research reconfigurable RF transceivers
To perform research on 45-nm RF transceivers targeting Gbit/s cognitive radios, Tokyo, Japan-based semiconductor supplier Renesas Technology ...
EDN
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Boffins toy with carbon nano-ribbons
Chemists at Stanford University have developed a new way to make transistors out of carbon nano-ribbons, which could be used to make ...
VNUNet
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Scientists integrate nanowire devices directly onto silicon
Scientists at Harvard, in collaboration with researchers from the German universities of Jena, Gottingen, and Bremen, have developed a ...
RF Design
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Novel transistor architectures boost polysilicon substrates, thick-oxide gates
Two research projects into novel transistor structures at the Advanced Technology Institute at the University of Surrey have extended the ...
EDN
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Melting reduces edge roughness, defects in IC features
A project at Princeton University shows that surface heating of small features on an IC can reduce edge roughness and, in some situations, ...
EDN
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Bit-shifting method performs fast integer multiplying by fractions in C
This Design Idea presents a method for fast integer multiplying and multiplying by fractions. What can you do when you lack access to a ...
EDN
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FPGAs target power-constrained designs
Actel has extended its Igloo series of low-power FPGAs with Igloo Plus. Whereas the company designed the original devices for maximum density ...
EDN
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Unraveling the dynamic-range specification in modern spectrum analyzers
Wireless-communication technologies are evolving from 2G, 2.5G, and 3G to 3.9G technologies. Consumer demand for seamless access to data and ...
EDN
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Improve Your Uptime
High Precision Dispense Tips
 The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology
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Today's Sponsor
Heraeus - Celebrating 40 years
of USA Manufacturing Excellence
 Heraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. While competitors are mainly focusing off shore, Heraeus is committed to serving all markets. Learn more about Heraeus materials…
Heraeus, Inc.
Red-E-Set Universal Boards Supports
ROI CALCULATOR
 Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more…
Production Solutions, Inc.
ShinEtsu Resists - Perfect for 3D packaging,
WLP, TSV and wafer bonding
 For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion.
ShinEtsu
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