We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers May 22, 2008 YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Bringing the Best Together Ablestik and Emerson & Cuming join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more … Henkel Corporation Letters Submit Design High Flex Cables On-Line with Web Tool Gore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more… W. L. Gore & Associates Top Story   As MEMS Revolution Takes Off, Small Is Getting Bigger Every Day Gnat-sized robots, microscopic gyroscopes, television beamed directly onto your retina. This may sound like a grocery list for a crazed ... Wired News High-Speed Stamp Soldering New white paper This paper examines stamp soldering, a solution that provides consistent amounts of molten solder onto a printed circuit board using static volumetric solder stamps during the through-hole soldering process. Click to learn more… Juki Corporation Industry News   North American semi equipment April sales dip reflects conservative industry mood, SEMI says Reflecting the ongoing conservative mood of the semiconductor industry, North America-based manufacturers of semiconductor equipment posted ... EDN Russians acquire IBM’s chip manufacturer Late in August 2007 the IBM and Infineon Technologies companies announced to have sold their joint enterprise Altis Semiconductor ... CNews Suntech Power net income doubles, beats target Suntech Power Holdings Co. shares rose in pre-market trades after it issued a bright 2008 forecast for its silicon solar panel manufacturing ... Market Watch Tessera files patent suit against 11 firms, units A U.S. trade court has agreed to take up a complaint that Tessera Technologies filed against 11 firms and related units, the panel said ... Reuters Chipmaking Gear Orders in Japan Log 1st Drop in 6 Years Orders in Japan for chipmaking equipment manufactured by both Japanese and foreign makers posted the first drop in six years in fiscal 2007, ... Japan Corporate News Fujitsu, Toshiba Deny Report on Chip Biz Alliance The major Japanese daily Yomiuri said in its Wednesday morning edition that Toshiba plans to acquire a majority stake in Fujitsu's ... Japan Corporate News DRAMs gear up for next-gen graphics Three DRAM makers are shipping parts using a new interface initially supporting data transfers at 4 Gbits/second per pin. The chips will ... EETimes How to Manage Pricing During Inflationary Times The inflation genie isn't yet out of the bottle but it is stirring. Core consumer prices are accelerating and commodity prices are projected ... Industry Week SEMI book-to-bill shows steep decline The book-to-bill ratio for US manufacturers of semiconductor equipment hit 0.81 according to SEMI, the sector’s trade body. So $81 worth of ... ElectronicsWeekly Agency agrees to probe LSI patent allegations The International Trade Commission has agreed to investigate allegations by two companies, LSI Corp and Agere Systems Inc, that their patent ... Reuters Rim Semiconductor's Marketplace Experiencing Rapid Growth The marketplace for the product that Rim Semiconductor Company makes is benefiting from a rapid expansion in spending at the world's wireline ... Centre Daily Times US Trade Agency to Investigate Semiconductor Complaint The U.S. International Trade Commission (ITC) has voted to investigate a patent complaint by semiconductor vendor Tessera, alleging that 11 ... PC World Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Technology News   Competing Lithography Technologies Share Heartaches Wrapping up two days of technology presentations on advanced-node lithography candidates, the panel discussion at last week’s Sematech ... Semiconductor International French Researchers Create Hydrogen Fuel Cell for Mobile Phone French researchers said Wednesday they had invented a hydrogen fuel cell as a backup power source for mobile phones, thus easing dependence ... Cellular-News Flex Center crafts active matrix The Flexible Display Center at Arizona University has successfully fabricated an active-matrix (AM) e-paper display on plastic, ... EETimes Intel says Nehalem chips on track for '08 2nd half Intel Corp is on track to ship its next generation of computer processors, code-named Nehalem, in the second half of this year, ... EETimes IDM economics at 32nm and beyond Masaaki Kinugawa, GM of Toshiba's Oita operations, discussed the tough challenges faced by fabs developing advanced processes today. Both ... Solid State Technology Mass-Producing Tunable Magnetic Nanoparticles Equally important, this method can be easily tailored to produce nanoparticles with a wide range of well-defined magnetic properties. ... PhysOrg Spectroscopic Ellipsometry of Compound Semiconductors AlxGa1-xN / GaN Hetero-Structures Using Equipment from Horiba Jobin Yvon Group III-Nitrides and their alloys are the most promising materials for short-wavelength optoelectronic devices such as LEDs, injection ... The A to Z of Nanotechnology Picoprojectors on the way Microvision will began shipping limited quantities of its picoprojector engine toward the end of this year, company spokesman Matt Nichols ... EETimes NXP technology saves enough energy to power 16.5 million light bulbs NXP Semiconductors has marked the progress of its environmentally conscious design process by announcing the production of the 400 ... WebWire It's not Smell-O-Vision, but MPEG seeks sensory effects But imagine a world where multimedia content on your mobile device could trigger sensory effects such as fear, suspense or affection--all ... EETimes Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Corporate News Submit OSRAM backlighting new 42-inch ultra-wide curved display OSTAR®-Projection LED modules from OSRAM Opto Semiconductors, Inc. are backlighting a new ultra-wide curved display from Ostendo ... OSRAM Opto Semiconductors, Inc. Asymtek's Spectrum S-822 Speeds Fluid Dispensing Throughput with Dual-Shuttle Configuration Asymtek introduces the Spectrum™ S-822 dispensing system with dual-shuttle stages to increase the productivity achieved in such processes ... Asymtek Keithley's Wireless Test System Wins Portable Design Magazine Best Product Competition Keithley Instruments, Inc. has won Portable Design Magazine's 2008 Editor's Choice Awards in the Test and Measurement category for its ... Keithley Instruments, Inc. Today's Sponsor Heraeus - Celebrating 40 years of USA Manufacturing Excellence Heraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. Our consolidated production area is a state-of-the-art facility with key personnel in sales, quality and research. Learn more about Heraeus materials… Heraeus, Inc. Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Run Cooler with Thermal Interface Materials from Shin Etsu Thermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. 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