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| Viewpoint | ||
February 1, 2022
VIEWPOINT 2022: Ramachandran "Ram" K. Trichur, Global Market Segment Head, Henkel
While automotive electrification, big data, mobile and 5G were all predicted to grow at a steady pace over the next several years, no one foresaw the hastening in demand condensed into twenty-four months. Because of this, the industry experienced severe IC shortages and a combination of supply chain factors. The demand was accelerated by the pandemic and its resultant 'X' from home trend, as well as harmful order behaviors (double ordering, inventory accumulation, expanded safety stocks, etc.). Together, these conditions along with pandemic-related staffing challenges created the perfect storm. Once a level of stabilization occurs, it's unlikely that the semiconductor industry will continue to experience this high level of demand going forward, though we do anticipate healthy, sustained growth as semiconductors have become essential to all economic activity and are no longer only tied to cyclical industry segments. Advanced packaging and heterogeneous integration are key drivers for data center, 5G and automotive applications and material challenges in all of these sectors persist. Large package body and die architectures, for example, require solutions to manage warpage and stress-related conditions. Stacked 2.5D and 3D devices are moving toward higher I/O counts and very dense interconnects, highlighting the need for robust underfills as well as molding materials for wafer-level packages employing fan-out constructions. These designs have traditionally been employed in mobile but are expanding to high-performance computing as well. Finally, in wirebond packaging, there is increased attention on high thermal die attach materials to address the growth of wide bandgap semiconductors in automotive electrification and other power electronics. For all of these next-generation applications where advanced adhesives, underfills and wafer-level encapsulants are key enablers, Henkel's broad portfolio is delivering for our leading global semiconductor packaging customers. Ramachandran "Ram" K. Trichur, Global Market Segment Head, Semiconductor Packaging Materials Henkel Corporation http://www.henkel.com |
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