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Viewpoint | ||
January 20, 2021
VIEWPOINT 2021: Dr. Thomas Uhrmann, Director of Business Development, EV GroupIn the coming year, as traditional 2D silicon scaling reaches its cost limits, the semiconductor industry will increasingly turn to heterogeneous integrationthe manufacturing, assembly and packaging of multiple different components or dies with different feature sizes and materials onto a single device or packagein order to increase performance on new generations of devices. Wafer-to-wafer (W2W) hybrid bonding, which involves stacking and electrically connecting wafers from different production lines, is a central process in heterogeneous integration and has a proven track record of success for certain applications such as CMOS image sensors and various memory and logic technologies. However, in cases where the components or dies are not the same size (e.g., chiplets), die-to-wafer (D2W) hybrid bonding offers a viable pathway to enabling heterogeneous integration. The infrastructure for D2W hybrid bonding is still in its infancy. However, new process solutions and close collaborations among process equipment and materials suppliers, as well as between suppliers, wafer fabs and OSATs, are on the rise and will play an essential role in creating best known methods of D2W hybrid bonding. This in turn will accelerate the deployment of 3D/heterogeneous integration. Dr. Thomas Uhrmann, Director of Business Development EV Group http://www.evgroup.com/ |
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