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February 12, 2020

VIEWPOINT 2020: Daniel Schultze, CEO, TRESKY Automation
VIEWPOINT 2020: Daniel Schultze, CEO, TRESKY Automation
Daniel Schultze, CEO, TRESKY Automation
The global semiconductor market was severely affected by the trade dispute between the United States and China. However, this did no harm to us.

Due to our stable order situation we confirm the forecasts of economic experts for the semiconductor industry, which says that the demand for electronic components will continuously increase in 2020.

Our die bonders serve many different markets, such as automotive, communications, aerospace, consumer electronics, medical technology, and data processing.

In particular, the automotive industry and its constant expansion of artificial intelligence as well as the increased conversion to electromobility will ensure a positive trend in the semiconductor market.

In 2019 we implemented various new options and tools to our machines. One example is the installation of new bond heads, which achieve a bond force up to 10kg. Furthermore, we are expanding our product line.

TRESKY Automation operates in the high mix, low volume segment. Due to our modular and flexible machine concept combined with numerous advanced options, we enable our customers to react as quickly as possible to new technologies, product requirements, and new market situations. We meet tomorrow's needs already today and are known for pushing "Made in Germany" to another level.

Daniel Schultze, CEO
TRESKY Automation