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February 11, 2020

VIEWPOINT 2020: Bruce Hueners, President & CEO, Palomar Technologies
VIEWPOINT 2020: Bruce Hueners, President & CEO, Palomar Technologies
Bruce Hueners, President & CEO, Palomar Technologies
2020 -- Advancing Technology for the Next Generation

Over the past 40+ years in the industry, Palomar Technologies has been at the forefront of delivering advanced solutions for microelectronic and photonics device assembly across a wide range of segments including, aerospace, automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, and telecom.

As we move from 2019 to 2020, we've closed out yet another decade of technological advances that have kept our customers in their leadership positions. Our mission, to create simple solutions for the complex problems, is embodied in the collaboration with our customers, including the R&D departments of three of the five top internet providers and the top five defense contractors in the world.

Moving into 2020, we expect to see continued growth and upsurge in two areas: 5G and electric vehicles and have developed several solutions specifically targeted for these growing markets.

LDMOS and GaN technologies for 5G base station power transistors require high thermal conductivity die attach methods to dissipate heat from the die. LDMOS requires eutectic AuSi attachment, while GaN requires AuSn eutectic or pressure-less Ag sinter attachment. To answer this latest trend in GaN attachment, we’ve developed a drop-in solution for pressure-less Ag-Sinter attachments to help our customers reduce changeover cost as they answer their own customers 5G requirements.

The power module market, especially the electric vehicle market is actively seeking a flux-free solder process that achieves low void rates, which provide for higher reliability and longer life. Our SST 8300 Series Automated Vacuum Pressure Soldering System differs from current systems on the market by utilizing SST’s unique system of applying both vacuum and gas pressure for the soldering interface of key components inside a power module, especially for DBC-to-base plate soldering.

Palomar has a unique position in the market in that not only do we design and manufacture die attach equipment, we provide precision assembly and test contract-manufacturing services for emerging electronic and photonic devices. Further, we acquired SST International in 2015 to expand our product line to Palomar die and wire bonders, as well as a full line of vacuum reflow systems, making Palomar a broad supplier of a wide range of epoxy, eutectic, solder and sintering equipment.

Bruce Hueners, President & CEO
Palomar Technologies