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January 14, 2020

VIEWPOINT 2020: Varun Singh, Product Line Manager, Carrier Solutions, Corning Inc.
VIEWPOINT 2020: Varun Singh, Product Line Manager, Carrier Solutions, Corning Inc.
Varun Singh, Product Line Manager, Carrier Solutions, Corning Incorporated
In recent years, there has been significant growth of fan-out wafer-level packaging, and we expect heavy adoption of fan-out (FO) technology for various packages by late 2020 and early 2021. Users of FO technology build the structure by adding a variety of materials over many steps, which makes warp control particularly challenging.

To address challenges like these and in response to market demand, Corning introduced Advanced Packaging Carriers (APC), a new product line dedicated to FO technology. The APC product line covers CTEs from 4.9 to 12.6ppm/°C with 0.2-0.3ppm/°C granularity and enhanced Young’s modulus values. The chosen Young’s modulus values reflect ~20% improvement over current market offerings and deliver warp performance without increasing customer risks in thermal-stress induced breakage.

A common complaint from FO R&D is the long lead times for samples. If a request for a new CTE takes a few months to be filled, impact on product development could mean the loss of new business. If a glass supplier can deliver small quantities of various CTE samples within weeks rather than months, there is significant value to customers. Corning offers APC wafers in R&D quantities with 4-6 weeks of delivery time.

With a rich product portfolio and short delivery time, Corning is positioned to support customers from product development all the way to mass production.

Varun Singh, Product Line Manager, Carrier Solutions
Corning Incorporated