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Viewpoint Index

January 21, 2019

VIEWPOINT 2019: Kim Arnold, Executive Director, Advanced Packaging Business Unit, Brewer Science Inc.
VIEWPOINT 2019: Kim Arnold, Executive Director, Advanced Packaging Business Unit, Brewer Science Inc.
Kim Arnold, Executive Director, Advanced Packaging Business Unit, Brewer Science Inc.
The need for ultrathin wafers continues to grow for power and memory devices, as manufacturers require higher-temperature processes to aid in heat dissipation and deliver performance improvements in wafer-level packaging (WLP).

To meet this demand, Brewer Science introduced in 2018 the first complete, dual-layer system for the temporary bonding/debonding of product wafers. This system is designed for devices with stringent requirements related to temperature, power and performance.

Our dual-layer bonding concept uses two materials: a thermoplastic bonding layer that conformally coats the device wafer topography; and a curable layer that, when applied to the carrier, provides easy bonding under low pressure with no melt flow post-curing.

Together, these two layers, which do not intermix or react with each other chemically, provide mechanical stability with no movement of bonding materials and thermal stability up to 400°C. This system can be used with either mechanical or laser debonding methods, providing flexibility to accommodate device makers' stringent requirements.

This faster, more streamlined process enables quicker time-to-market and increased functionality for handheld electronic products. It can also benefit many other hot markets where we see rapid growth continuing in 2019, such as 5G, mobile computing, artificial intelligence, Industry 4.0 and smart vehicles.

Kim Arnold, Executive Director, Advanced Packaging Business Unit
Brewer Science Inc.