| Viewpoint |
January 18, 2019
VIEWPOINT 2019: Warren Flack, VP of Worldwide Lithography Applications, Veeco Instruments
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Warren Flack, VP of Worldwide Lithography Applications, Veeco Instruments
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While the growth of mobile devices is projected to remain stagnant next year, we don't expect this to hold true for FOWLP. High demand for memory and greater processing power will require steady expansion of high and low-density FOWLP in 2019. Another driver will be 5G, expected to reach production phase in Q3. 5G also presents a broader opportunity for Veeco to leverage promising materials like GaN to innovate around temperature and loss challenges in RF/power applications.
FOWLP will enable next generation high-performance electronics but brings with it unique processing requirements such as handling highly warped substrates and imaging over large local topography. As an advanced packaging lithography leader, Veeco will build on this expertise to enhance and introduce new products in 2019 with improved productivity and higher resolution, providing customers with some of the most competitive solutions available to customers.
FOWLP will also play a significant role in memory as mobile DRAM converts to flip-chip packaging and high-end memories move to advanced packaging. The memory packaging flip-chip business is expected to reach 13% of the market within four years, meaning new opportunities for Cu-Pillar, WLCSP and TSV. This has prompted OSATs to ramp memory packaging capabilities, and Veeco's lithography offerings are well-positioned to meet their requirements.
Warren Flack, VP of Worldwide Lithography Applications
Veeco Instruments
http://www.veeco.com/
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