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January 15, 2019
VIEWPOINT 2019: Poupak Khodabandeh, Vice President and Global Head Semiconductor Packaging Materials, Henkel Corporation
The electronics assembly value chain is in the midst of a renaissance and the semiconductor packaging industry is at the center of this transformation. Significant consolidation and shifts across the pillars of the electronics assembly industry -- with impacts to the semiconductor packaging ecosystem -- are being driven by consumer appetite for smaller, higher functioning and increasingly connected devices. The result is a proliferation of system-in-package (SiP) configurations, with both electronic manufacturing service (EMS) and outsourced assembly and test (OSAT) companies vying to own this assembly segment. With the move toward SiP, increasing data demands, faster processing speeds and the emergence of 5G, wafer- and panel-level packaging (WLP and PLP) adoption is on the rise and traditional wafer fabrication companies are in the driver's seat. The convergence of assembly and semiconductor technologies alongside technology acceleration requires material solutions that can enable advanced performance while delivering on sustainability objectives with environmentally friendly, reworkable formulations to facilitate a circular economy. How will you differentiate your company and technology? Henkel is one of the few materials suppliers that serves the entire electronics value chain and, therefore, is well-positioned to enable the current industry transition. A strong portfolio of semiconductor packaging materials such as die attach products, first level underfills and encapsulants; and, an expansive range of PCB assembly materials including conductive inks, solders, underfills, protection and thermal control solutions puts Henkel in an enviable position as a leading total solutions provider. This comprehensive offering combined with Henkel's focus on sustainability and considerable chemistry toolbox gives us and our customers a significant advantage. Will you introduce new products or expand into new markets? Our new developments are designed to meet the market's sustainability, miniaturization, high frequency performance and high reliability requirements. Specifically, Henkel's work in the area of electromagnetic interference (EMI) shielding for components overcomes the RF isolation challenges of SiPs and addresses the demands of emerging 5G standards. Additionally, new encapsulation products for wafer- and panel-level packaging provide reliable, scalable and environmentally-friendly solutions for high-density advanced packaging applications. Poupak Khodabandeh, Vice President and Global Head Semiconductor Packaging Materials Henkel Corporation http://www.henkel.com |
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