VIEWPOINT 2019: Michael Chalsen, President, MRSI Systems

MRSI Systems enters 2019 with two new product families MRSI-HVM3 and MRSI-H3 (complementing our traditional market-leading MRSI-705 and MRSI-M3 products for R&D/medium volume production). These two product families are targeted towards high-volume applications driven by 5G wireless, data center, telecommunication, industrial lasers, and emerging markets of LiDAR and VR/AR.

MRSI-HVM3, launched in 2017, is now a family of products, offering high volume die bonding solutions, for CoC, PCB and Gold-box packaging. The recent launch of our MRSI-H3 family of products for TO and LD applications will meet the specific needs of photonics manufacturers launching the next generation of TO-can photonic devices, such as WDM & EML-TOs and high power diode lasers.

Depending on the application, photonic manufacturers can now choose one die bonding machine from these two new product families to meet their high volume requirements with superior flexibility for multi-die, multi-process, and multi-product manufacturing.

The uniqueness of these new products delivers industry-leading speed without sacrificing flexibility, precision or reliability. By covering the spectrum of volume and applications, our "One- Stop-Shop" solutions ensure our customers deliver just-in-time supply of fast-pace innovations of critical photonic components, for high growth market segments such as hyper-scale data centers, photonic sensors, and 5G wireless.

Michael Chalsen, President
MRSI Systems
http://www.mrsisystems.com

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