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Viewpoint Index

February 14, 2018

VIEWPOINT 2018: Poupak Khodabandeh, VP, Henkel Electronic Materials LLC
VIEWPOINT 2018: Poupak Khodabandeh, VP, Henkel Electronic Materials LLC
Poupak Khodabandeh, Vice President and Global Head Semiconductor Packaging Materials Steering Unit, Henkel Electronic Materials LLC
With growth in the data storage, industrial and IoT sectors, and the proliferation of sensor technology across multiple applications, Henkel anticipates continued strong semiconductor market performance.

These market dynamics and resultant device designs will require materials with unique performance characteristics to address complexity, miniaturization and reliability.

Henkel's committed to meeting these market demands with adhesive platforms that enable thinner bondlines and the use of thinner wafers; minimize warpage and control stress in thin packages; and provide low temperature and dual curing mechanisms for delicate sensor applications.

In addition, managing the thermal load produced by data storage, industrial and automotive products is a top priority for increased reliability. New, process-friendly high thermal die attach pastes and materials to improve thermal conductivity have also been added to the Henkel portfolio and are already proving successful.

The convergence of smaller, more complex device designs and significantly higher functionality is highlighting the importance of material capability and Henkel is delivering with formulations to enable next-generation semiconductor technology.

Poupak Khodabandeh, Vice President and Global Head Semiconductor Packaging Materials Steering Unit
Henkel Electronic Materials LLC