|
|
Viewpoint | ||
February 14, 2018
VIEWPOINT 2018: Poupak Khodabandeh, VP, Henkel Electronic Materials LLCThese market dynamics and resultant device designs will require materials with unique performance characteristics to address complexity, miniaturization and reliability. Henkel's committed to meeting these market demands with adhesive platforms that enable thinner bondlines and the use of thinner wafers; minimize warpage and control stress in thin packages; and provide low temperature and dual curing mechanisms for delicate sensor applications. In addition, managing the thermal load produced by data storage, industrial and automotive products is a top priority for increased reliability. New, process-friendly high thermal die attach pastes and materials to improve thermal conductivity have also been added to the Henkel portfolio and are already proving successful. The convergence of smaller, more complex device designs and significantly higher functionality is highlighting the importance of material capability and Henkel is delivering with formulations to enable next-generation semiconductor technology. Poupak Khodabandeh, Vice President and Global Head Semiconductor Packaging Materials Steering Unit Henkel Electronic Materials LLC http://www.henkel.com |
We search for industry news so you don't need to. | ||
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|