VIEWPOINT 2018: Michael Chalsen, President, MRSI Systems

MRSI Systems enters 2018 with its strongest family of products since the company was formed in 1984. The need has never been greater for customers to optimize their performance of such metrics as process yield, throughput, and uptime.

The recent launch of our MRSI-HVM3, a high speed, flexible, 3 micron die bonder, addresses the challenge being faced by our customers in 2018.

In 2018 and beyond, we will continue to see our customers scale up manufacturing to unprecedented levels for advanced applications such as data center, telecommunication upgrades to 100G+, 5G wireless, IoT, and advanced optical sensors.

This high volume manufacturing of photonic, sensor, and semiconductor devices demands die bonding solutions that can deliver industry leading speed without sacrificing high precision and superior flexibility. Specifically, we see our new MRSI-HVM3 and other products in development meeting this growing need.

We are confident that our global markets including Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Sensors, and Industrial will show continued growth during 2018

Michael Chalsen, President
MRSI Systems
http://www.mrsisystems.com

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