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Viewpoint | ||
January 30, 2017
VIEWPOINT 2017: Poupak Khodabandeh, Global Head, Semiconductor Packaging Materials Steering Unit, Henkel Electronics Materials, LLCWith over 30 years of proven success in semiconductor materials innovation, experienced sales and technical service teams and a broad portfolio of products, Henkel sets itself apart from other suppliers when it comes to supporting automotive applications. Our record at being first to market with platforms like package-level EMI shielding and conductive die attach film enables our customers to be first in their respective product sectors. Henkel expects to commercialize several new materials that facilitate production of products with high thermal and high reliability requirements. Among these are novel film-based wafer-level underfill materials for copper pillar and TSV technologies, as well as warpage control adhesives. We are also evaluating how Henkel's chemistry expertise can provide solutions to front end semiconductor fabrication as packaging technologies move from OSATs to Fab houses. EMI shielding at the package level is another area where Henkel has focused intense development efforts, resulting in a suite of materials to eliminate electromagnetic interference within SiP and SoC devices. While the past several years of growth have been largely driven by smartphone and tablet advances, the next five to ten years will see automotive, IoT and wearables take center stage. Unit growth will be modest, though there will be pockets of high growth and profitability. Poupak Khodabandeh, Global Head, Semiconductor Packaging Materials Steering Uni Henkel Electronics Materials, LLC http://www.henkel-adhesives.com/electronics.htm |
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