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Viewpoint | ||
February 18, 2016
VIEWPOINT 2016: Jonathan Doan, Director of Marketing, Nordson MARCHFor the wafer level packaging (WLP) market, Nordson MARCH is seeing demand for panel-based chip-scale packaging systems. Instead of creating reconstituted wafers of known good dies, packaging OEMs and foundries are moving towards panels as large as 600x600mm to maximize yield, while minimizing cost. MARCH plans to meet these trends by expanding upon our SPHERE Series of plasma systems. In the traditional packaging markets of plasma prior to wire-bonding and under-fill, the prediction by most analysts is an overall contraction of the market for 2016. MARCH views this downturn as an opportunity to introduce platforms such as the FlexTRAK-CDT, which will replace older, discontinued systems that have high maintenance cost, consume more floor space and low throughput. Jonathan Doan, Director of Marketing Nordson MARCH http://www.nordsonmarch.com |
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