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Viewpoint Index

January 11, 2016

VIEWPOINT 2016: Uday Mitra, V.P., Etch and Patterning, Applied Materials
VIEWPOINT 2016: Uday Mitra, V.P., Etch and Patterning, Applied Materials
Uday Mitra, V.P., Strategy & Marketing, Etch and Patterning, Applied Materials
Looking ahead to 2016, I see continued momentum toward a more connected world made possible by advancements in semiconductor technology. The increased complexity of high-performance logic and memory chips combined with continued device scaling will require new materials and more challenging process steps to manufacture. To address these issues and enable technology inflections, Applied Materials will focus on delivering innovations in materials engineering and precision processes to our customers.

Given the scope of the challenges, from etch to deposition technologies, chipmakers are looking for new process methods and equipment capabilities. Requirements include more advanced atomic-level control and uniformity, high selectivity and materials innovations for new patterning and conformal films. In particular, selective material deposition and removal will play a new and prominent role in sub 10nm/1x nanometer production.

With multiple materials used to fabricate complex structures, being able to selectively remove or deposit one material in a target area without touching or damaging the other materials is vital to manufacturability.

With the breadth and pace of innovations, I expect the industry will make significant progress in several ongoing developments in 2016. Among the top priorities is the ramp of 10-nanometer process technology. Advancing the 10-nanometer platform is critical to driving historic performance gains and bringing next-generation chip designs to market.

Another goal we expect to see achieved is the high-yield production of chip designs with three-dimensional architectures. There is a strong cost and device performance incentive for memory manufacturers to make the transition to 3D NAND. Finally, there will be growing interest in the emergence of new storage-class memory technologies to better handle the unprecedented amounts of data being generated by global connectivity.

Uday Mitra, Vice President, Strategy & Marketing, Etch and Patterning
Applied Materials