VIEWPOINT 2016: Patrick Donovan Marketing Development Manager, Sonix, Inc.

At Sonix we prioritize our R&D investments to maximize the value of Scanning Acoustic Microscopy (SAM) as a defect inspection solution for MEMS, CMOS Image Sensor (CIS), Wafer Level Packaging (WLP), Advanced Packaged Devices, and Through Silicon Via (TSV) applications.

Building on our recent throughput and ease of use improvements, we anticipate growing adoption of SAM in response to further advancements in defect sensitivity, and capability to scan non-planar surfaces.

Going forward into 2016 we anticipate steady growth in these markets as SAM solutions continue to provide increased value as a non-destructive (NDT) subsurface defect inspection technology.

We anticipate increased adoption across all applications, but especially in the high volume manufacturing of bonded wafer devices such as MEMS and CMOS image sensor devices. For these bonded wafer applications SAM solutions with high throughput, high resolution, and the capability to scan non-planar surfaces are proving to be an invaluable yield management tool to verify bond integrity at the wafer and at the device level.

Patrick Donovan, Marketing Development Manager
Sonix, Inc.
http://www.sonix.com

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