| Viewpoint |
January 30, 2015
Jonathan Doan, Director of Marketing, Nordson MARCH
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Jonathan Doan, Director of Marketing, Nordson MARCH
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For the markets that Nordson MARCH serves, we see strong growth in wafer-level packaging (WLP), not only for chip-scale WLP (CS-WLP) but further up the semiconductor line where the wafers are thinned and singulated.
Our customers are moving towards packaging when the wafer is still on the carrier or some film. Our new, thinned wafer plasma chamber was specifically developed for these customers.
Nordson MARCH's core market of plasma prior to wire bonding and underfill will still garner orders, but we anticipate even stronger growth in the electronics packaging sector. These applications use plasma to assist in the fabrication of modules that will be integrated into mobile and portable electronics. Capacity and flexibility are paramount for these customers, which was the reason why we introduced the FlexTRAK-S chamber in 2014.
Jonathan Doan, Director of Marketing
Nordson MARCH
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