Frank Folmsbee, Sales Manager, Aries Electronics Inc.

At Aries, we anticipate that device manufacturers will continue to develop chips with smaller pitch. This is why we have developed a new spring probe capable of contacting devices with pitch as small as 0.2mm.

These new probes enable socketing (for test and burn-in applications) for many new device packages and bare-die being designed and made on this pitch. The contact and spring material are gold plated beryllium-copper. The probes are available with either a pointed �tip of crown-shaped termination.

These new probes will yield >100k cycles over a temperature range of -55deg to +150degC. This performance makes these probes ideal for socketing for bench test or burn-in applications. In addition, these probes yield a very low inductance (~0.59nH) signal path making them compatible with testing RF devices at 10 Ghz and beyond. They require about 6g of compression to actuate and can be placed on a .004� diameter PCB pad.

These probes can be used with any of Aries standard molded AND machined CSP socket bodies. This enables the customer to use this socket on any new or previously existing test (or burn-in) board.
Frank Folmsbee
Aries Electronics Inc.
http://www.arieselec.com

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