Neil O'Brien, General Manger, FINETECH

Finetech continues to offer the most precise device bonders in the market. We deliver sub-micron accuracy in a modular design not only in tabletop bonders, but also fully-automatic systems. R&D labs and engineers needing a true pathway to production see this value.

Sub-micron precision is critical for the latest complex applications. When a technology change demands a new process solution, our base systems can be adapted. This is what we like to refer to as staying "future-proof".

In March of 2014, Finetech broke ground on a new 60,000 sq. ft. state-of-the-art production and development center in Berlin, Germany. This nearly 8 million Euro investment is a strong commitment to Finetech's continued growth. The new eco-friendly facility will position us for expansion in R&D, product engineering, applications, and support staff for many years to come. Our customers will benefit from the expanded ISO Class 6 cleanroom space for special assembly and application work. As we open the new facility in early 2015, we look forward to introducing new ideas and technologies to the market.

We had a very strong 2014 in the advanced packaging market. I see the demand continuing in 2015. This leading edge microelectronics world drives so much innovation. Whether it is a VCSEL, MEMS, FlipChip, Sensor or unique device, Finetech thrives in this new technology frontier. In 2015, we are better positioned than ever to deliver world class solutions.

Neil O'Brien, General Manger
FINETECH
http://www.finetechusa.com

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