Andy C. Mackie, PhD, MSc, Senior Product Manager, Indium Corporation

As we head into 2015, Indium Corporation's strengths as a materials supplier continue to grow in areas that are critical for emerging semiconductor assembly and packaging technologies:

Mobile Device Logic: For low-cost ultra-thin mobile logic applications, Indium Corporation's ultra-low residue (ULR) flip-chip fluxes, especially NC-26-A, are becoming the benchmark for performance, enabling a transition from increasingly problematic water-wash to true no-clean processes, without sacrificing yield or long-term device reliability.

3D (Stacked) Memory: Indium Corporation�s wafer bumping fluxes, such as WS-3543 and WS-3401, which remove oxide and organics from plated solder bumps after resist-strip, are now enabling the generation of low-oxide, extremely coplanar solder bumps for reliable, high-yield, stacked memory die.

Small Form-Factor Low-Power Devices: As legislative demands continue to push lead (Pb) out of its pivotal role in power management devices, customers are looking for a drop-in, high-reliability, Pb-free die-attach material that can pass J-STD-020 MSL1, 2, and 3 criteria. Indium Corporation's BiAgX(R) high-temperature Pb-free solder paste technology can meet that need. Manufacturing costs for these devices must be kept low, and for power semiconductor components that can still use high-lead solders, our ultra-low residue SMQ(R)75 "Power-Safe" solder paste has become the industry standard around the world for clip-bonded applications.

Small Form-Factor High-Power (>10W) Devices: The adoption of GaN and SiC are driving the need for operability at higher junction temperatures, and for the near future, gold-tin (AuSn20) solder paste, wire, and preforms can meet the need for low RDSON and high thermal conductivity between die and substrate. Higher melting materials are already under development at Indium Corporation to meet emerging higher-temperature needs, with capabilities to meet die-attach stability requirements at junction temperatures (Tj) up to 450degC.

MEMS/Sensors: Packaging MEMS devices is always tricky, as the moving parts have to be hermetically-sealed or partially sealed, making cleaning complex or impossible. Ultra-low residue, no-clean solder pastes, such as Indium Corporation's SMQ(R)77, are enabling such sealing, while avoiding the risks associated with flux spatter inside the device.

IoT Remote Devices: An IoT ("Internet of Things") device must combine a variety of functions: power harvesting and remote connectivity, sensors or actuators (or both), memory, logic, and finally, security. Indium Corporation's expanding range of ultrafine solder pastes (types 6, 6-SG, and 7) can meet the need for reliable electrical connectivity in these ultra-small form factor devices
Andy C. Mackie, PhD, MSc, Senior Product Manager
Indium Corporation
http://www.indium.com

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