Doug Dixon, Global Marketing Director, Henkel Electronics Materials, LLC

Henkel consistently leads the semiconductor packaging market with innovative and enabling technologies. We plan to continue this track record! We were the first to develop and commercialize robust conductive die attach film (CDF) materials and this portfolio has been met with broad market acceptance. In fact, Henkel's LOCTITE ABLESTIK CDF materials are making new device designs possible and are in widespread use with may wireless device technologies.

The ingenuity of the Henkel team has led to other developments such as in-package EMI shielding solutions and novel ink technologies that are viable alternatives to ITO for touch screen applications. These distinctions are just a few examples of Henkel's market leadership.

In 2015, Henkel will grow in all areas � in new markets with new products and an expanded team. Our innovation portfolio is delivering on expectations and the industry can expect to see further advancement and product commercialization with our in-package EMI shielding materials, non-conductive pastes (NCPs) for fine-line flip-chip technologies, conductive die attach film and unique ink formulations. Our investment in R&D and sales personnel will continue into 2015, as we expand our global footprint and accelerate the pace at which we bring new products to market.

Well-known industry analyst Henderson reported semiconductor growth rate of more than 9% in 2014 and we anticipate another year of modest growth in 2015. While overall market expansion is certainly a key component of Henkel's annual growth, we expect several of our materials innovations to produce very good results next year. Advances in die attach, mold compounds, non-conductive pastes, EMI shielding and clear conductive inks are set to make significant contributions to our business.
Doug Dixon, Global Marketing Director
Henkel Electronics Materials, LLC

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