January 30, 2014
Rachel Miller-Short, VP of Sales & Marketing, Photo Stencil
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Rachel Miller-Short, VP of Sales & Marketing, Photo Stencil
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Tooling sets for the semiconductor industry require
relatively quick turnaround coupled with extremely tight tolerances for
spacing. As more R&D assembly and NPI evaluations are finding their way
into the market, the demand for quick-turn solutions will be even greater in
2014.
To address that and other challenges created by the
shrinking spheres used to attach packages, R&D was a major focus for Photo
Stencil last year as we developed new coatings and a totally new type of
stencil. We’ve also been conducting research with industry partners on a large
array of tool sets and tool set/coating combinations to evaluate and determine
which provide the best solutions while keeping in mind the shrinking lead-time
requirements.
These activities will be on-going throughout next year as we
continue to differentiate ourselves by providing a full range of stencils,
constantly innovating to produce stencils and squeegee blades to handle developing
applications and manufacturing requirements, and to work one-on-one with each
customer to ensure they achieve their desired printing results.
Rachel Miller-Short, VP of Sales & Marketing
Photo Stencil
http://www.PhotoStencil.com
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