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January 30, 2014

Rachel Miller-Short, VP of Sales & Marketing, Photo Stencil

Rachel Miller-Short, VP of Sales & Marketing, Photo Stencil
Rachel Miller-Short, VP of Sales & Marketing, Photo Stencil
Tooling sets for the semiconductor industry require relatively quick turnaround coupled with extremely tight tolerances for spacing. As more R&D assembly and NPI evaluations are finding their way into the market, the demand for quick-turn solutions will be even greater in 2014.

To address that and other challenges created by the shrinking spheres used to attach packages, R&D was a major focus for Photo Stencil last year as we developed new coatings and a totally new type of stencil. We’ve also been conducting research with industry partners on a large array of tool sets and tool set/coating combinations to evaluate and determine which provide the best solutions while keeping in mind the shrinking lead-time requirements.

These activities will be on-going throughout next year as we continue to differentiate ourselves by providing a full range of stencils, constantly innovating to produce stencils and squeegee blades to handle developing applications and manufacturing requirements, and to work one-on-one with each customer to ensure they achieve their desired printing results.

Rachel Miller-Short, VP of Sales & Marketing
Photo Stencil