January 23, 2014
Neil O'Brien, Sales & Applications Director, FINETECH
|
|
Neil O'Brien, Sales & Applications Director, FINETECH
|
Finetech will continue to differentiate itself by offering the highest
placement accuracy in bonding and advanced packaging equipment. This level of
precision is critical for today’s ever-changing, complex applications. The
process flexibility built around our systems allows customers to use a single
platform for various technologies.
We have always been more than an equipment supplier; we have the
engineering strength to help our users with their most difficult processes and
to customize machine solutions. When you
consider the rapid changes in technology and processes, the depth of process experience
we offer is more important than ever in 2014.
In early 2014, we are breaking ground on a new 60,000 sq. ft. factory
headquarters in Berlin, Germany.
Finetech’s new facility will allow for our planned growth in engineering,
applications, and support staff. New
clean room space will house final assembly and test areas. Particularly important to our customers will
be the expanded clean room space for our applications lab and our special
sub-micron system assembly area.
I see
steady growth in 2014 for the semiconductor packaging market, particularly for
MEMS, Sensors, Optoelectronics, and Silicon Photonics. The innovations in microelectronics are penetrating
so many areas of our everyday lives... from sensors in our clothing and the
vehicles we drive, to implantable medical devices. These leading edge
microelectronics will help fuel the growth.
Finetech will help assemble this technology, whether in form of 3D, chip
to wafer, or packages soldered to a printed circuit board.
Neil O'Brien, Sales & Applications Director
FINETECH
|
