January 16, 2014
Frederic Raynal, CTO, Alchimer
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Frederic Raynal, CTO, Alchimer
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In the semiconductor advanced packaging space, we expect to
see ramping of 3D TSV technologies happen in 2014, and our business will be
closely linked to this ramp. At Alchimer, we work with key players in the 3D
TSV market space with our insulator, barrier, seed and fill products. Our
technologies are compatible with via-first, via-mid, via-last and interposer
technologies, and we anticipate this market sector growing rapidly in the
coming year.
3D TSVs face cost and technological challenges before they
can become truly mainstream technologies. For example, there is a need to
achieve very-high-aspect ratios for the insulation, barrier, seed and fill
steps for TSV metalization.
Current approaches deposit nonconformal layers inside
the vias, limiting process control. What sets Alchimer's electrografting
processes apart from other metalization processes--such as electroless and
electroplating—is that our chemical baths contain complex, nonacidic
chemistries that create a chemical link between the surface and the coating
that results in a covalent bond to create highly controlled, conformal
metalization layers.
Our plans for 2014 center on working with our equipment and
manufacturing partners to further penetrate the 3D TSV market with our products,
as well as hiring to increase our technical support capabilities at user sites,
in line with increased technology adoption. We will also continue to explore
new markets that will benefit from our wet chemical processes, such as solar
and flex markets.
Frederic Raynal, CTO
Alchimer
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