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January 14, 2014

Mayson Brooks, SVP Worldwide Sales & Field Operations, Rudolph Technologies

Mayson Brooks, SVP Worldwide Sales & Field Operations, Rudolph Technologies
Mayson Brooks, SVP Worldwide Sales & Field Operations, Rudolph Technologies
The continuing transition in consumer electronics to mobile technologies is increasing the drive of miniaturization in the semiconductor industry. Three dimensional integrated circuits (3DIC) and advanced packaging technologies are important new technologies that operate "More than Moore" to increase computing density by means other than reducing the size and number of transistors.

Both approaches require equipment and device manufacturers to work together to modify front-end-like technologies to create novel structures using new materials and to transition these front-end manufacturing techniques to the back-end. For example, at Rudolph, we have introduced variants of our industry-standard inspection and metrology systems incorporating new 3D sensors and analytical techniques designed specifically for through silicon via (TSV) and micro bumping.

Our lithography systems are purpose-built to deliver better performance at lower cost of ownership in advanced packaging processes, including the ability to accommodate larger, more efficient panel substrates. In 2014, innovations, such as these, will remain the lifeblood of our industry to enable us to meet the emerging demands of our customers.

Mayson Brooks, SVP Worldwide Sales & Field Operations
Rudolph Technologies, Inc.