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January 14, 2014
Mayson Brooks, SVP Worldwide Sales & Field Operations, Rudolph Technologies
Both approaches require equipment and device manufacturers to work
together to modify front-end-like technologies to create novel structures using
new materials and to transition these front-end manufacturing techniques to the
back-end. For example, at Rudolph, we have introduced variants of our industry-standard
inspection and metrology systems incorporating new 3D sensors and analytical techniques
designed specifically for through silicon via (TSV) and micro bumping. Our lithography systems are purpose-built to deliver better performance at lower cost of ownership in advanced packaging processes, including the ability to accommodate larger, more efficient panel substrates. In 2014, innovations, such as these, will remain the lifeblood of our industry to enable us to meet the emerging demands of our customers. Mayson Brooks, SVP Worldwide Sales & Field OperationsRudolph Technologies, Inc. http://www.rudolphtech.com |
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