January 6, 2014
Leo Linehan, Global Business Director, Dow Electronic Materials
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Leo Linehan, Global Business Director, Dow Electronic Materials
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Dow
offers enabling materials at the chip, package and board levels, allowing the
company to address the immediate needs of its customers as well as to
anticipate changes that may affect customers several steps further along the
supply chain. Packaging is a particularly interesting space to be in right now,
as it's growing and driving the industry at large.
Increased functionality
relies more and more heavily on packaging and Dow's enabling materials. Driven
by mobile applications, we expect growth in the industry in 2014, with
packaging slightly ahead of the semiconductor industry.
Differentiation
remains very important in the industry, particularly since the standards model
used for semiconductor manufacturing affects--but does not directly determine--requirements
in the packaging space. Dow differentiates itself and its products with its
deep understanding of material science and strong partnerships with our
customers. The 3D IC space is a good example, as it's seen strong investment,
and most of the materials are by and large ready.
Yet the industry is holding
back a bit, waiting for the process cost and technology to come together to
achieve a cost-competitive solution before 3D enters the mainstream. In 2014,
Dow will continue to innovate and work with customers to bring new materials to
market that enable the next generation of advanced packages and that support
the requirements of tomorrow’s portable devices.
Leo Linehan, Global Business Director
Dow Electronic Materials
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