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Viewpoint Index

January 6, 2014

Leo Linehan, Global Business Director, Dow Electronic Materials

Leo Linehan, Global Business Director, Dow Electronic Materials
Leo Linehan, Global Business Director, Dow Electronic Materials
Dow offers enabling materials at the chip, package and board levels, allowing the company to address the immediate needs of its customers as well as to anticipate changes that may affect customers several steps further along the supply chain. Packaging is a particularly interesting space to be in right now, as it's growing and driving the industry at large.

Increased functionality relies more and more heavily on packaging and Dow's enabling materials. Driven by mobile applications, we expect growth in the industry in 2014, with packaging slightly ahead of the semiconductor industry.

Differentiation remains very important in the industry, particularly since the standards model used for semiconductor manufacturing affects--but does not directly determine--requirements in the packaging space. Dow differentiates itself and its products with its deep understanding of material science and strong partnerships with our customers. The 3D IC space is a good example, as it's seen strong investment, and most of the materials are by and large ready.

Yet the industry is holding back a bit, waiting for the process cost and technology to come together to achieve a cost-competitive solution before 3D enters the mainstream. In 2014, Dow will continue to innovate and work with customers to bring new materials to market that enable the next generation of advanced packages and that support the requirements of tomorrow’s portable devices.

Leo Linehan, Global Business Director
Dow Electronic Materials