April 24, 2013
IPC ESTC Presenting the Titans of the Industry
The IPC Electronic System Technologies Conference and
Exhibition (ESTC), which spans the entire spectrum of the electronics industry,
will be held at the New Tropicana, Las Vegas, Nevada, May 20-23, 2013. A review
of the show web site at www.ipc.org/estc
shows the well-known names and companies coming together at this inaugural
The electronics industry is not the same today as what it
used to be even 10 years ago. Gadgets like GPS, pagers, cell phones, and MP3
players have been combined into cell phones and tablets; laptops evolved into
ultrabooks; and CRT TVs evolved into ultra-slim, smart and HD TVs. In
this industry where there is ongoing integration, restructuring, cost
reduction, and no shortage of change, silos are breaking down and engineers are
finding themselves interacting with many aspects of the industry, from foundry
to design to surface mount. It has become vital to have a holistic view
of the industry for product development, innovation, sales growth, and
The more complex systems get, the more subtle changes in the
design of one section can alter performance in other areas. Similarly, small
changes in component selection and layout can make it easier to manufacture and
test a module. Getting all parts of the electronics industry together in an
annual event can open up new horizons, ideas and contacts which can help
resolve the calcified issues that develop in silos.
Companies realize the need to alter their development
processes to take a systems-wide view, but making these changes can be
difficult. IPC is responding to this need with an end-to-end event to bring the
entire industry together. "IPC ESTC is not just bringing the supply chain
together -- this event is bringing together supply and demand," says
Sanjay Huprikar, IPC's vice president of member success. "We believe this can
facilitate a more thorough assessment of new products and services."
This approach is receiving enthusiastic support from the
industry even in the first year of IPC's ESTC, as is evident from the number of
technical presentations, exhibitors, and sponsors. Several companies are
sponsoring workshops, receptions, refreshments, and even a conference polo
shirt to have their names visible at this key gathering. Three of the top four
outsourced assembly and test providers (OSATs) are prominently involved in the
conference. Recognizing IPC's efforts in creating added value to the
electronics industry, Intel Corp is sponsoring the "IPC ESTC Best Paper Award"
to encourage and identify technical excellence. Lenovo is contributing to the
raffle with its latest multi-mode ultrabook Ideapad Yoga, and Microsoft with
Xbox Kindle. It is not wait-and-see and become a late adopter or follower
anymore. It is about utilizing this readily available opportunity at the IPC
ESTC or simply miss it.
IPC Electronic System Technologies Conference and Exhibition
(ESTC) will bring a wealth of technical information and open up new contacts
for attendees. The conference will run May 20–23, with an accompanying
exhibition on May 21–22 at the New Tropicana Hotel in Las Vegas. "This new
event is not solely dedicated to packaging, design or PCBs, but covers all of
those areas through technical presentations, keynote addresses, and
professional development courses,” says Senol Pekin, Ph.D., MBA, Intel
Corporation, and general chair of the event. “The program committee, consisting
of close to one hundred industry professionals, put together a comprehensive
program. Eight keynote speakers will address high level issues, trends and
opportunities in the industry. The keynote speakers include James Quinn, VP of sales
for Multitest Elektronische Systeme GmbH, Dr. Choon Lee, senior vice
president for Amkor Technology, Dr. Raj Pendse, chief marketing officer at
STATS ChipPAC, Raj Master, GM of IC Packaging, SiOps, Quality and Reliability
for Microsoft, Dr. An-Yu Kuo, senior architect at Cadence Design Systems, Zane
Ball, general manager of Desktop Client Platforms for Intel Corp., Derrill
Wolkins, Medtronic's director of product development, and Dr. Tin-Lup Wong, distinguished
engineer and executive director of Lenovo’s Product Group Technology.
The conference at ESTC is equally all-encompassing. There
are 13 technical tracks, where data-driven papers will be presented. Tracks for
the conference include: product design and development; assembly and SMT; PCB
fabrication, materials and design; quality and reliability; fabrication and silicon;
test; equipment, tools and modules; packaging and substrates; mechanics;
thermals; electrical; materials; and industry analysis and issues.
Professional development courses and sponsored workshops
offered by recognized leaders and companies will augment the keynote speakers
and technical sessions: Advanced
Packaging offered by Ravi Mahajan and Bob Sankman of Intel Corp., Soldering Technology for Electronics
Assembly offered by Tim Jensen of Indium Corp., Simulation Based Reliability Assessment offered by Michael Osterman
of CALCE-University of Maryland, PCB
Fabrication Basics offered by Jim Hogen and Don Schmieder of Plexus Corp,
and Extreme High Density offered by
Happy Holden of Gentex Corp. The cost is only $300 per course. The sponsored
workshops Design for Reliability
offered by Ops A La Carte, DDR3 Interface
Design offered by Cadence and Multiphysics
Simulation offered by Ansys, are free to conference attendees.
"We are all looking forward to ESTC ...A unique conference...
Great meeting ground for OEMs, IC vendors and packaging companies," says Dr.
Rays Pendse, chief marketing officer, STATS ChipPAC. Registration for IPC ESTC
is now open though the web site at www.ipc.org/estc.
There is $100 discount for early-bird or group registration.