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February 11, 2013

Joseph S. Bubel, President, The Americas, Hesse Mechatronics

Joseph S. Bubel,  President, The Americas, Hesse Mechatronics
Joseph S. Bubel, President, The Americas, Hesse Mechatronics
Effective January 1, 2013, Hesse & Knipps will become Hesse Mechatronics. This change is a move back to the company's roots, named Hesse GmbH when first launched in 1986. The new name signifies more accurately what we do -- which is to develop and manufacture the most advanced thin wire wedge bonders and heavy wire bonders in the world utilizing mechatronics, or a multidisciplinary engineering approach. Our outlook for 2013 in the Americas includes:

  1. Maintaining our leadership position in the world market for fully automatic thin wire wedge bonding equipment
  2. Significant growth in market share for our heavy wire bonder business
  3. Heavy investment in R&D, with some exciting product announcements planned for 2014

Power semiconductors and power modules will continue to grow the heavy wire bonder market in 2013. Our new BONDJET BJ931L Dual Head Heavy Wire Bonder, making its debut at SEMICON Shanghai, and our BONDJET 935/939 Series, are well positioned to serve these markets.

Worldwide, the strongest growth will occur in the power module segment for automotive, energy and other industrial applications with an increase in manufacturing focus in the Americas. To support the increasing business in this region, we will continue to invest in growing and training our technical support and sales staff.

In short, we look forward to an exciting year for wire bonding in 2013 and beyond!

Joseph S. Bubel, President, The Americas
Hesse Mechatronics