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February 6, 2013

Rudy Kellner, VP & GM, Electronics Business Unit, FEI

Rudy Kellner, VP & GM, Electronics Business Unit, FEI
Rudy Kellner, VP & GM, Electronics Business Unit, FEI
Advanced packaging technologies will play an increasingly important role in improving the performance of integrated circuits. This is particularly true of circuits intended for mobile applications where space is limited by the handheld nature of the device, and digital, analog and radio frequency components must be tightly integrated.

As new packaging technologies are more widely adopted, the ability to quickly modify completed packages to troubleshoot problems, test modifications and produce limited quantities of prototypes for customer evaluation will provide increasing value.

Conventional focused ion beam (FIB) tools, which use liquid metal sources, have long been used for die-level modifications, but they cannot remove material fast enough to work effectively on the scale required for packaging applications.

At the IPFA meeting this year, Qualcomm and FEI reported the use of high-speed plasma-based FIB to shorten the R&D cycle in advanced packaging applications, modifying and testing prototypes in less than a day -- which would have taken weeks with conventional approaches.

Faster turnaround will accelerate the design and ramp-to-production phases of new product development and shorten time-to-market for new products, ultimately conferring significant competitive advantage in the fast-paced market for mobile electronics.

Rudy Kellner, VP & GM, Electronics Business Unit