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January 23, 2013

Dan Dunkly, President, Yield Engineering Systems, Inc.

Dan Dunkly, President, Yield Engineering Systems, Inc.
Dan Dunkly, President, Yield Engineering Systems, Inc.
As electronic devices become more consumer-oriented, production costs and efficiency become higher priority. Because of these changes in technology, Wafer-level packaging (WLP) is a steadily growing industry.

WLP has the ability to enable true integration of wafer fab, packaging, test and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment. WLP is a high growth trend in the semiconductor packaging industry, and Yield Engineering Systems (YES) has positioned itself to be prepared for this niche market.

One of the predominant technologies that are rising quickly within WLP is Redistribution Layers (RDL). From YES' background of Polymer Processing established in the 1980's, we have captured a small but significant part of the WLP/RDL industry.

We are seeing a momentous increase in future revenue and major technical interest in our automatic units for WLP/RDL. Everyone sees the importance of cheaper, thinner, smaller and faster devices, and YES sees 2013 as a year of great revenue potential.

Dan Dunkly, President
Yield Engineering Systems, Inc.