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January 9, 2013

Doug Goodman, CEO, Ridgetop Group, Inc.

Doug Goodman, CEO, Ridgetop Group, Inc.
Doug Goodman, CEO, Ridgetop Group, Inc.
Ridgetop has been asked by its customers to provide innovation in two important areas largely ignored by mainstream instrumentation suppliers: rapid sub-20 nm characterization and verification test tools for complex 2.5D and 3D packages. Both areas require new approaches to handle the problems, and will provide much-needed support for higher performance, higher density, and lower cost IC manufacturing.

With sub-20 nm characterization, in 2013 fabless IC firms can now do their own "bake off" comparisons between competing foundries by applying foundry-independent test structures. This enabling technology reduces their dependence on characterization data from foundry process design kits (PDKs) and can provide a platform for optimization in the targeted use environment. Combined environmental and process degradation effects can be examined in hours, not weeks.

For complex multi-layer IC packages, such as 2.5D and 3D, Ridgetop has partnered with a major interposer firm and assembled a team of its engineers to develop in-situ methods of testing the interconnections between layers that affect short- and long-term reliability. Troublesome intermittencies can be detected before shipment to customers, and monitored continuously in critical applications with Ridgetop's Predictive Analysis technologies.

Doug Goodman, CEO
Ridgetop Group, Inc.