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January 7, 2013
Peter Himes, VP Marketing & Strategic Alliances, Silex
For 2013, we see continued demand for advanced all-silicon packaging, whether for MEMS only, MEMS to ICs, or interposer based solutions for MEMS and ICs both. Silex, with our Sil-Via® and Met-Via® TSV technology platforms, is broadly engaged in all of these areas and we see this trend continuing through 2013. Advanced materials also drives the MEMS industry, and so we have active R&D programs in advanced materials such as PZT and ferromagnetics. As a pure play foundry, we can mix and match materials in MEMS construction that ordinary CMOS foundries cannot offer, and as such help our customers succeed through innovation in materials, design, and processing. Peter Himes, VP Marketing & Strategic Alliances Silex http://www.silexmicrosystems.com |
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