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May 8, 2012

Die Bonder Donation to a University or College Research Center

Die Bonder Donation to a University or College Research Center
Neil O'Brien, Director of Sales, Finetech
Finetech will donate a high accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. In conjunction with the company's 20th anniversary this year, Finetech is celebrating the university R&D segment of their business with this machine donation.

FINEPLACER(R) die bonders provide an ideal solution for advanced microelectronic assembly and packaging in diverse technology environments. Typical applications include flip chip, micro-optics assembly, precise die bonding, optoelectronics, 3D, MEMs, wafer level integration, sensor packaging and more.

Die Bonder Donation to a University or College Research Center


The bonders are extremely modular and offer researchers and labs a full spectrum of bonding processes - thermo-compression, thermo-sonic, eutectic, indium,  as well as an inert atmosphere and forming gas.

 

Die Bonder Donation to a University or College Research Center
This is a unique opportunity for a university lab or research center to bring in a 5 micron placement accuracy bonder at no cost (valued at $100,000). Many labs do not have the budget for research equipment and they either go without or share tools with another education or corporate facility. With grant writing and submission being such an extensive process, this could be an easy pathway for one fortunate facility. Registration is very simple, just a brief entry form is required. The random drawing will be held in August, registration is open until July 31.



Neil O'Brien , Director of Sales
Finetech