Karl Bloechl, President, cyberTECHNOLOGIES

In anticipation of an eventual recovery, we invested during the down-turn. Even during the deepest part of the recession the company hired software- and hardware engineers in order to continue our momentum forward on new product developments. Within the last three years, cyberTECHNOLOGIES launched its new product family, the CT-Series, which at this point consists of seven systems for single and dual sided measurements: CT 100, CT 300, CT 600S, CT 250T, CT 350T, CT 450T and CT R200.

These systems enable process development, failure analysis and production control efforts in a broad range of applications and industries. The systems are widely used in laboratory and production environments, for heavy, large, thin, small and round parts. The versatile design of our CT-series provides outstanding performance in most any application in 3D metrology. The fact that we have always heavily invested in our own metrology software platform has lead to a metrology software suite that continues to be regarded by our customers, as one of the key reasons in choosing our systems, aside from the reliable and well engineered hardware.

We are better prepared than ever to provide our customers with accurate and precise measurement systems. cyberTECHNOLOGIES will be adding new products and new services in the coming year.

The activities in the past and the roadmap for 2012 and beyond will clearly support the company’s growth plans for years to come.

We started to see signs that the overall market situation in the US is improving as early as mid 2011 and have strong indication that it will further strengthen this year. The recovery of the overall economy, albeit on a slow pace and the need for companies to invest in advanced technologies in order to remain competitive or regain their market leads, paired with cyberTECHNOLOGIES’ abilities to serve a varied and diverse range of applications and markets at the highest level of performance will help to further extend cyberTECHNOLOGIES’ strong position in the surface and 3D metrology space.