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February 22, 2012

Thomas J Green, Technical Director, TJ Green Associates LLC

Thomas J Green, Technical Director, TJ Green Associates LLC
Thomas J Green,
Technical Director,
TJ Green Associates LLC
Packaging and assembly of custom high tech microelectronics requires a complex array of skills sets. The US workforce, particularly in the military and aerospace industry is quickly aging.

Critical packaging skills, such as those needed to assess thermal and mechanical stresses in complex microcircuit packages, hybrids and microwave modules are not being replaced as the baby boomers retire. Basic materials and process knowledge is lacking.

TJ Green Associates LLC, a company that specializes  in training  process and quality engineers has anticipated this need and developed a complete set of "on line" educational materials for 2012. The industry trend is clearly to migrate away from instructor led classroom training, however there is a downside.

In my opinion while "on line" training may be cheaper and more convenient, nothing replaces the learning efficiency of face to face dialog, complete with facial expressions, tone of voice and direct eye to eye contact.

Traditional classroom training also allows for tailoring of the course material to suit the individual and company need, real time Q&A with the instructor, and is the preferred format for communication of complex engineering and technical skills.  Choose wisely there is lots to learn!

Thomas J Green, Technical Director
TJ Green Associates LLC