February 22, 2012
Thomas J Green, Technical Director, TJ Green Associates LLC
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Thomas J Green,
Technical Director,
TJ Green Associates LLC
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Packaging and assembly of custom high tech microelectronics requires
a complex array of skills sets. The US workforce, particularly in the military
and aerospace industry is quickly aging.
Critical packaging skills, such as those
needed to assess thermal and mechanical stresses in complex microcircuit
packages, hybrids and microwave modules are not being replaced as the baby
boomers retire. Basic materials and
process knowledge is lacking.
TJ Green
Associates LLC, a company that
specializes in training process and quality engineers has anticipated
this need and developed a complete set of "on line" educational materials for
2012. The industry trend is clearly to
migrate away from instructor led classroom training, however there is a
downside.
In my opinion while "on line"
training may be cheaper and more convenient, nothing replaces the learning
efficiency of face to face dialog, complete with facial expressions, tone of
voice and direct eye to eye contact.
Traditional classroom training also allows
for tailoring of the course material to suit the individual and company need,
real time Q&A with the instructor, and is the preferred format for
communication of complex engineering and technical skills. Choose wisely there is lots to learn!
Thomas J Green, Technical Director
TJ Green Associates LLC
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