Viewpoint
February 21, 2012

Joseph S. Bubel, President, Hesse & Knipps, Inc.



Joseph S. Bubel, President, Hesse & Knipps, Inc.
Joseph S. Bubel,
President, Hesse &
Knipps, Inc.
At Hesse & Knipps, Inc., the Americas subsidiary of Germany-based Hesse & Knipps Semiconductor Equipment (www.hesse-knipps.com) -- we experienced significant growth in 2011, with a 50% increase in revenue over FY2010.

Our forecast remains strong for this year, with growth expected for heavy wire bonding technology in the power electronics market. We also project continued dominance in the thin wire bonding market with continued growth into the RF and microwave market segment.

Technology wise, HCR(TM) (high current ribbon) capability on our heavy wire bonders, which supports power electronics applications, has been very well received by equipment users, and PiQC(TM) - our patented "Process Integrated Quality Control" technology continues to be the only system available that measures five critical parameters for every wire bond in real time.

Where competing wire bonding systems are likely to continue production and damage parts, our proprietary system protects our customers' investment in high value components by stopping production whenever bond quality is in question. Our thin wire/wedge bonding technology is also generating a lot of excitement in the area of miniaturization for memory devices.

We added to our support staff in 2011 and also recently partnered with our rep organization Chalman Technologies to open a West Coast Demo and Applications Laboratory in Anaheim, CA. The new demo lab enables our western region customers to more conveniently test and troubleshoot their applications on our Bondjet BJ 820 High Speed Fully Automatic Fine Wire Wedge Bonder and enables prospective customers to validate the capabilities and qualify our wedge bonders prior to making an equipment purchase.

The Demo and Applications Lab is staffed with Hesse & Knipps applications engineers who work directly with our customers. We also have an established East Coast Demo and Applications Lab in Sterling, MA.

In summary, we look forward to another great year in 2012 with increased business and inroads into new and existing markets.

Joseph S. Bubel, President
Hesse & Knipps, Inc.
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address