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February 17, 2012

Paul Feeney, Process Technology Director, Axus Technology

Paul Feeney, Process Technology Director, Axus Technology
Paul Feeney, Process
Technology Director,
Axus Technology
2011 was an excellent year for Axus Technology and we anticipate that trends in packaging will help lead to an even better 2012. Axus Technology provides equipment (polishers, grinders, and cleaners) and services (processing and maintenance) for planarization.

Our main business has historically been in support of semiconductor wafers and substrates, but in the past year our activity in packaging has really increased. As the trends in electronics continue to drive the semiconductor industry firmly toward increased functionality in small form factors, we have found two types of planarization for packaging that are seeing significant increases: thinning and 3D.

As the percentage of thinned die continues to increase, we anticipate that 2012 will bring larger needs for both grinders and grinding services. Our business in both those areas saw large gains in 2011 and we believe that growth trend should continue.

We are also seeing growth in planarization requirements for 3D packaging. This means special CMP steps on both the front and back sides of the wafer, and thinning on the backside.

Additionally, we expect to see growth in MEMS and lighting applications. We have been asked to help with bonding and thinning of a wide range of heterogeneous materials for these applications and we expect that range to keep growing in 2012.

Paul Feeney, Process Technology Director, Axus Technology
Axus Technology